Unlock Precision in Wafer Measurement with MicroProf AP

MicroProf^® AP, a fully automated wafer metrology tool, can be used for an extensive range of applications at various 3D packaging process steps, including the measurement of photoresistcoatings and structuring, through silicon viasor trenches after etching, μ-bumps and Cu pillars, in addition to measurement in thinning, bonding, and stacking processes.

Thisversatile measuring tool is perfectly suited to carry out a range of measuring tasks in advanced packaging, thanks to its modular multi-sensor concept.

Additionally, the MicroProf^® AP offers complete measurement solutions for the control of various substrates, including bulk Si, SOI, cavity SOI, compounds like GaAs, InP, SiC, GaN, and ZnO, as well as transparent materials. These applications include backside processing (backgrinding, metallization) for power semiconductors like MOSFET or IGBT.

Moreover, it can be applied to Micro Electro Mechanical Systemsand hybrid bonding, which are used in the automotive, telecom, consumer electronics, medical, and industrial sectors.

Highlights

Versatile multi-sensor metrology instrument for advanced packaging

For each stage of the process, from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking, and molding

Wafer handling unit with open cassettes and FOUPs/FOSBs that meet SEMI standards

Customized setup for each application

Retrofit on demand

Image Credit: Camtek FRT Metrology.

Image Credit: Camtek FRT Metrology.