Master Bond Inc.
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Nanusens is pioneering sensors built inside CMOS. Nanusens patent-pending technology shrinks MEMS sensors and builds nano-scale sensors (NEMS – Nano Electro Mechanical Systems) along with the control electronics using standard CMOS processes. This creates single chip solutions that are up to ten times smaller than the equivalent multi-package MEMS. The freed-up space can be used for larger batteries for longer operational life battery or additional features. Many different sensors can be built into the same tiny chip to enhance the user experience and differentiate products without taking up more space. Its expertise and pending patents place it as the uncontested leader in this technology that will revolutionise the next generation of sensors.
Nanusens also uses its innovative technology to create DTCs (Digital Tuneable Capacitors) or RF switches for 5G smartphones. Again, by shrinking these MEMS into the CMOS layers along with the control electronics on the same die, Nanusens saves space. Founded in 2014 by Dr. Josep Montanyà, Dr. Daniel Fernández and Dr. Marc Llamas, Nanusens is headquartered in London, England with Research and Development offices in Barcelona, Spain and Shenzen, China. It leverages the research and expertise developed by the founders’ previous company, Baolab Microsystems. Nanusens is VC funded by Inveready (www.inveready.com/venture-capital/), Caixa Capital Risc (www.caixacapitalrisc.es/en/) and Dieco Capital (www.dieco-capital.com), and crowdfunding via Crowdcube.
Adhesives, Sealants, Coatings and Potting / Encapsulation Compounds Master Bond is a leading man……...
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