Univation Technologies, LLC
Univation Technologies is the world’s largest supplier of catalysts for polyethylene produc……...
Cleaving Kit with Mat
The crucial step in obtaining good cross-sections is to scribe and cleave cleanly. The LatticeGear Cleaving Kit offers a complete set of tools to both scribe and cleave neatly and is suitable for different substrates and wafers such as Si, GaAs, and glass.
Specifications
Diamond Scribe-pen style
Diamond Scribe-straight tip
Diamond Scribe-30° tip
Tweezers with black soft fiber fine tip (length 6 ¼”)
CleanBreak Pliers-wafer cleaving pliers
Large 18” x 12” cutting mat-self healing, wafer cutting mat
Small ruler mat-self healing, small wafer piece ruler mat
Clear plastic ruler with metric and US units
Tungsten cleaving wire
Price: US$320
Cleaving Kit with Mat
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