Cleaving Kit with Mat

The crucial step in obtaining good cross-sections is to scribe and cleave cleanly. The LatticeGear Cleaving Kit offers a complete set of tools to both scribe and cleave neatly and is suitable for different substrates and wafers such as Si, GaAs, and glass.

Specifications

Diamond Scribe-pen style

Diamond Scribe-straight tip

Diamond Scribe-30° tip

Tweezers with black soft fiber fine tip (length 6 ¼”)

CleanBreak Pliers-wafer cleaving pliers

Large 18” x 12” cutting mat-self healing, wafer cutting mat

Small ruler mat-self healing, small wafer piece ruler mat

Clear plastic ruler with metric and US units

Tungsten cleaving wire

Price: US$320

Cleaving Kit with Mat

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