[db:国别翻译]英国I Holland有限公司
/9-9-I-9M-9M-9-9A-9-9G-9G-9E-1/ 超过六十年的研究,发展和投资已经确立了荷兰成为杰出的拳头供应商……...

The crucial step in obtaining good cross-sections is to scribe and cleave cleanly. The LatticeGear Cleaving Kit offers a complete set of tools to both scribe and cleave neatly and is suitable for different substrates and wafers such as Si, GaAs, and glass.
Specifications
Diamond Scribe-pen style
Diamond Scribe-straight tip
Diamond Scribe-30° tip
Tweezers with black soft fiber fine tip (length 6 ¼”)
CleanBreak Pliers-wafer cleaving pliers
Large 18” x 12” cutting mat-self healing, wafer cutting mat
Small ruler mat-self healing, small wafer piece ruler mat
Clear plastic ruler with metric and US units
Tungsten cleaving wire
Price: US$320

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/9-9-I-9M-9M-9-9A-9-9G-9G-9E-1/ 超过六十年的研究,发展和投资已经确立了荷兰成为杰出的拳头供应商……...
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