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Automated Photonic Device Assembly with Modular System Approach
AssemblyLine systems, which are high-precision, alignment and assembly machine solutions, are developed for automated manufacture (align-and-attach) of photonic devices.
They exclusively integrate flexible attachment configurations and fast-active alignment with a tried and tested software control interface, encompassed in an industry-standard design. Optional modules offer additional features, and the high-end models offer wafer processing capability, optical test modules, and automatic tool changing.
New, next-generation in-line assembly systems from ficonTEC incorporate a redesigned platform (400, 800, 1200, 1600). They come in particular in-line configurations as an all-around and individual production cell for existing production lines. Alternatively, it is also possible to supply them as task-optimized production segments that consist of various distinctly configured systems. In principal, it is possible to visualize even entire production lines.
Software Control
ProcessControlMaster (PCM) from ficonTEC is a process-oriented, user-friendly application software and control interface that is available with all multi-machine configurations and turnkey systems. PCM incorporates an insightful UI with all high-resolution positioning, machine vision, and system management routines needed for reliable and repeatable driving of passive/active alignment and attachment/bonding process hardware. It is also already completely enabled for automated electro-optical test and characterization tasks. It can also operate and monitor single lines, and even sync parallel lines remotely.
Key Features
Fully-automated photonic device assembly
Configurable closed-loop fast-active alignment
High-precision AUTOALIGN multi-axis motion
Multiple chip and wafer handling options
Epoxy dispensing, curing, and shrinkage control
General Tasks and Applications
Pick-and-place
Thermal or UV curing
Precision adhesive dispensing
Chip-to-package assembly
Active mirror align-and-attach
Fiber/FAC/SAC align-and-attach
HPLD module assembly
Active VBG spectral tuning
Hybrid integrated photonics
PICs, silicon photonics
Modular, Flexible and (Re-)Configurable
FAB and HVM-ready — parallelizable and scalable
Sophisticated feed IN/OUT options
Daisy-chain multiple systems for production segments
Single systems slot into existing production lines
Add and/or swap modules for reconfiguration and repurposing
Operate, monitor, and sync parallel lines remotely
| A400 | A800 | A1200 | A1600 | |
| Motion System | 4-axis alignment | Gantry system with min. 6-axis high-precision alignment* | Gantry system with min. 6-axis high-precision alignment*ORCantilever system w/o multi-axis system | Cantilever system with min. 6-axis high-precision alignment* |
| Working Area (max)(w x b x h, mm) | 100 x 200 x 200 | 100 x 300 x 50** | 200 x 300 x 50** | 200 x 100 x 50** |
| Handling Options | Single conveyor | Single or dual conveyor | ||
| Wafer Capable | No | Up to 6” | Up to 12” | |
| Machine Vision | Standard/dual positioning and observation camera options | |||
| Feed Options | Suitable for Jedec or Auer boats, or for customer trays | |||
| Software Features | Ergonomic, flexible and powerful process software – extended operator-less control – remote control server option | |||
| Physical Features | Rugged steel-base production cell - access door lifts vertically without affecting footprint | |||
| Minimum connections | 400 VAC (or country specific), air/vacuum, 100 Mbit/s network | |||
| Cleanroom compliance | ISO 6*** | |||
| Dimensions(w x b x h, mm) | 400 x 1200 x 1600/2000 | 800 x 1200 x 1600/2000 | 1200 x 1200 x 1600/2000 | 1600 x 1200 x 1600/2000 |
| Weight (typ., kg) | 600 | 1300 | 1800 | 2500 |
*alternative multi-axis configurations optional
**working area with 6-axis system
***others available on request
Automated Photonic Device Assembly with Modular System Approach
Assembly line systems - Picture 1Assembly line systems - Picture 2
Assembly line systems - Picture 3High-precision alignment unitFiber/FAC/SAC attachAdhesive dispensing
Silicon PhotonicsDie sortingFiber alignmentThermal or UV curing
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