Automated Photonic Device Assembly with Modular System Approach

AssemblyLine systems, which are high-precision, alignment and assembly machine solutions, are developed for automated manufacture (align-and-attach) of photonic devices.

They exclusively integrate flexible attachment configurations and fast-active alignment with a tried and tested software control interface, encompassed in an industry-standard design. Optional modules offer additional features, and the high-end models offer wafer processing capability, optical test modules, and automatic tool changing.

New, next-generation in-line assembly systems from ficonTEC incorporate a redesigned platform (400, 800, 1200, 1600). They come in particular in-line configurations as an all-around and individual production cell for existing production lines. Alternatively, it is also possible to supply them as task-optimized production segments that consist of various distinctly configured systems. In principal, it is possible to visualize even entire production lines.

Software Control

ProcessControlMaster (PCM) from ficonTEC is a process-oriented, user-friendly application software and control interface that is available with all multi-machine configurations and turnkey systems. PCM incorporates an insightful UI with all high-resolution positioning, machine vision, and system management routines needed for reliable and repeatable driving of passive/active alignment and attachment/bonding process hardware. It is also already completely enabled for automated electro-optical test and characterization tasks. It can also operate and monitor single lines, and even sync parallel lines remotely.

Key Features

Fully-automated photonic device assembly

Configurable closed-loop fast-active alignment

High-precision AUTOALIGN multi-axis motion

Multiple chip and wafer handling options

Epoxy dispensing, curing, and shrinkage control

General Tasks and Applications

Pick-and-place

Thermal or UV curing

Precision adhesive dispensing

Chip-to-package assembly

Active mirror align-and-attach

Fiber/FAC/SAC align-and-attach

HPLD module assembly

Active VBG spectral tuning

Hybrid integrated photonics

PICs, silicon photonics

Modular, Flexible and (Re-)Configurable

FAB and HVM-ready — parallelizable and scalable

Sophisticated feed IN/OUT options

Daisy-chain multiple systems for production segments

Single systems slot into existing production lines

Add and/or swap modules for reconfiguration and repurposing

Operate, monitor, and sync parallel lines remotely

*alternative multi-axis configurations optional

**working area with 6-axis system

***others available on request

Automated Photonic Device Assembly with Modular System Approach

Assembly line systems - Picture 1Assembly line systems - Picture 2Assembly line systems - Picture 3High-precision alignment unitFiber/FAC/SAC attachAdhesive dispensingSilicon PhotonicsDie sortingFiber alignmentThermal or UV curing