Flexible Multi-Mode Zeta™-20 3D Optical Profiling Microscope

The Zeta™-20 benchtop optical profiler is a non-contact 3D microscope and surface topography measurement system.

This 3D optical profiling system has been powered by patented ZDot™ technology and Multi-Mode optics, allowing measurement of a range of samples: transparent and opaque, smooth to rough texture, low to high reflectance, and step heights ranging from nanometers to millimeters.

The Zeta-20 3D optical profiling system combines six optical metrology technologies in one configurable and user-friendly system. ZDot measurement mode concurrently gathers a high-resolution 3D scan and a True Color infinite focus image.

Other 3D measurement methods include Nomarski interference contrast microscopy, white light interferometry, and shearing interferometry. Film thickness could be quantified with ZDot or a combined broadband reflectometer.

The Zeta-20 is a high-end microscope for sample review or automated defect inspection. The Zeta-20 3D optical profiling microscope assists R&D and production environments by offering extensive roughness, step height, film thickness measurements, and defect inspection capability.

N95 mask fiber topography measured by the Zeta-20. Image credit: KLA Instruments™

Copper laser via topography measured by the Zeta-20. Image credit: KLA Instruments™

Key Features

User-friendly optical profiler with ZDot and Multi-Mode optics to fulfill an extensive range of applications

High-quality microscope available for sample review or defect inspection

ZDot: concurrently gathers a high-resolution 3D scan and a True Color infinite focus image

ZXI: White light interferometry for extensive area measurements with high z resolution

ZIC: Interference contrast for quantitative 3D data of surfaces with sub-nanometer roughness

ZSI: Shearing interferometry for images available with high z resolution

ZFT: Film thickness and reflectance are quantified with a combined broadband reflectometer

AOI: Automatic optical inspection to measure defects on the sample

Production capability: completely automated measurements with sequencing and pattern recognition

Image Credit: KLA Instruments™

Applications

Surface topgraphy: visualize and measure surface features in 3D

Step height: 3D step height from nanometers to millimeters

Stress: 2D thin film stress

Form: 3D bow and shape

Texture: 3D roughness and waviness on smooth to highly rough surfaces

Film thickness: transparent film thickness ranges from 30nm to 100µm

Defect inspection: capture defects greater compared to 1µm

Defect review: KLARF files may be utilized to navigate to defects to quantify 3D surface topography or scribe defect locations

Image Credit: KLA Instruments™

Industries

Solar: photovoltaic solar cells

Semiconductor and compound semiconductor

Data storage

Semiconductor WLCSP (wafer-level chip scale packaging)

Semiconductor FOWLP (fan-out wafer-level packaging)

PCB (printed circuit board) and adaptable PCB

MEMS: Micro-electro-mechanical systems

Medical devices and microfluidic devices are provided

Universities, research labs, and institutes

Image Credit: KLA Instruments™