Zeta™-388 Non-Contact 3D Optical Profiler for Fully Automated Measurements

The Zeta-388 optical profiler is an advanced non-contact 3D surface topography measurement system. Leveraging the capabilities of the Zeta-300, the Zeta-388 is equipped with a cassette-to-cassette handler for fully automated measurements.

This system harnesses patented ZDot technology and Multi-Mode optics, enabling the measurement of a diverse range of samples. It can handle transparent and opaque materials, low to high reflectance surfaces, smooth to rough textures, and step heights spanning from nanometers to millimeters.

The Zeta-388 automated optical metrology system combines six different optical metrology technologies within one user-friendly and customizable platform.

In ZDot measurement mode, it simultaneously acquires high-resolution 3D scans and True Color infinite focus images. It also incorporates other 3D measurement techniques like white light interferometry (VSI and PSI), Nomarski interference contrast microscopy, and shearing interferometry. Film thickness measurements can be quantified using ZDot or the integrated broadband reflectometer.

The Zeta-388 is a high-end microscope, suitable for sample review and automated defect inspection. It accommodates various applications, supporting both R&D environments by delivering comprehensive measurements of step heights, roughness, film thickness, defect inspection, and efficient cassette-to-cassette wafer handling.

The Zeta-388 is designed to provide automated metrology solutions for the manufacturing of wireless devices, such as Surface Acoustic Wave (SAW), Bulk Acoustic Wave (BAW), and Thin Film Bulk Acoustic Resonator (FBAR) devices.

Image Credit: KLA Instruments™

Features

Non-contact optical profiler featuring ZDot and Multi-Mode optics for versatile applications

Functions as a high-quality microscope for sample review and defect inspection

ZI mode uses white light interferometry (VSI and PSI) for wide-area measurements with high z resolution

ZDot mode captures high-resolution 3D scans and True Color infinite focus images simultaneously

ZSI mode utilizes shearing interferometry for images with high z resolution

ZIC mode employs interference contrast for quantitative 3D data of sub-nanometer surface roughness

ZFT mode measures film thickness and reflectance using an integrated broadband reflectometer

Offers production capability with fully automated measurements, sequencing, and pattern recognition

Includes AOI (Automatic Optical Inspection) for defect quantification on samples

Features a wafer handler for automatic loading of both opaque (e.g., silicon) and transparent (for example, sapphire) samples ranging from 50 mm to 200 mm in diameter

Image Credit: KLA Instruments™

Applications

Step Height: Measure 3D step heights spanning from nanometers to millimeters.

Form: Assess 3D bow and shape characteristics.

Stress: Evaluate 2D thin film stress.

Texture: Analyze 3D roughness and waviness on surfaces ranging from smooth to very rough.

Film Thickness: Determine transparent film thickness within 30 nm to 100 µm.

Defect Inspection: Detect and capture defects larger than 1 µm in size.

Defect Review: Utilize KLARF files for navigating to defects and measuring their 3D surface topography or marking defect locations.

Image Credit: KLA Instruments™

Industries

Wireless Device Manufacturing: Specializing in SAW, BAW, and FBAR device production.

LED Applications: Covering light-emitting diodes and PSS (patterned sapphire substrates).

Semiconductor WLCSP (wafer-level chip scale packaging)

Semiconductor FOWLP (fan-out wafer-level packaging)

Semiconductor Industry: Serving both semiconductor and compound semiconductor sectors.

PCB Expertise: Including printed circuit boards (PCBs) and flexible PCBs.

MEMS Solutions: Catering to Micro-electro-mechanical systems (MEMS).

Medical Device Support: Assisting in the development of medical devices and microfluidic devices.

Image Credit: KLA Instruments™