ZEISS Crossbeam-FIB-SEM for High Throughput 3D Analysis and Sample Preparation

With the ZEISS Crossbeam-FIB-SEM, users can integrate the imaging and analyzing capabilities of a high-resolution field emission scanning electron microscope (FE-SEM) with the processing capabilities of a next-generation focused ion beam microscope (FIB). Users may be operating in a multi-user facility, an academic or industrial lab.

The users can benefit from ZEISS Crossbeam’s modular platform concept to expand the system as customer demands increase, such as with the LaserFIB for huge material ablation. Crossbeam will accelerate the FIB applications during milling, imagingand 3D analytics.

Maximize SEM Insights

Increase FIB Sample Throughput

Experience Best 3D Resolution in FIB-SEM Analysis

Highlights

Maximize SEM Insights

Using Gemini electron optics, get real sample information from the high-resolution SEM photos

Using a variety of detectors, thoroughly characterize the sample. With the Inlens EsB detector, users can get clean materials contrast

Examine non-conductive specimens that have not been harmed by charging artifacts

For 2D surface, sensitive picturesor during 3D tomography, rely on the SEM capabilities of the ZEISS Crossbeam

Tandem decel, a feature of the new ZEISS Gemini electron optics, can provide up to 30% higher SEM resolution at low voltage

Even when employing very low acceleration voltages, benefit from great resolution, contrastand signal-to-noise ratios

Image Credit: Carl Zeiss Microscopy GmbH

Increase FIB Sample Throughput

The Ion-sculptor FIB column presents a unique approach to FIB processing: By avoiding sample damage, users may improve sample quality while still completing experiments quicker

When preparing TEM samples, make use of the Ion-sculptor FIB’s low voltage capabilities to get ultra-thin samples with minimal amorphization damage

Use up to 100 nA current to manipulate the samples accurately and quickly without sacrificing FIB resolution

Take advantage of the speed and accuracy of smart FIB scanning techniques for material removal to speed up the investigations by up to 40%

Image Credit: Carl Zeiss Microscopy GmbH

Experience Best 3D Resolution in FIB-SEM Analysis

Collect the serial section images during milling to save time. For active picture quality control, use trackable voxel sizes and automated algorithms to achieve precision and consistency

ZEISS Atlas 5, the market-leading package for quick, accurate tomography, may be added to the Crossbeam to increase its capacity

ZEISS Atlas 5’s integrated 3D Analytics tool allows users to do EDS and EBSD analyses during tomography runs

In FIB-SEM tomography, the best 3D resolution and leading isotropic voxel size provide unique insights. The Inlens EsB detector can probe to a depth of less than 3 nm and provide surface sensitive, material contrast pictures

For EDS and EBSD examinations, make use of the advantages of integrated 3D analysis

Crossbeam will accelerate FIB applications during milling, imagingand 3D analytics

Image Credit: Carl Zeiss Microscopy GmbH