X200–X-Ray Metrology and Defect Inspection

As advances in semiconductor devices demand tighter tolerances, smaller interconnects, and more vertical layers, product quality and reliability need to be ensured by quickly, accurately, and non-destructively identifying latent defects early in the manufacturing process.

The X200 from Bruker integrates high speed and high resolution to provide a one-of-a-kind, no-compromises, in-line X-Ray defect inspection solution. To provide fully automatic, fast, 100% inspection, and real-time feedback, X200 employs proprietary data collection architecture, industry-leading data processing, and innovative machine learning techniques.

Only the X200 Delivers

Rapid, high-resolution X-Ray imaging that finds even the smallest latent defects across an entire die in seconds

Complete automation from imaging to data processing, with real-time feedback for constant use on the manufacturing floor

Advanced Data Analysis Toolkit with image processing-based machine learning algorithms to accelerate and standardize defect detection

Incorporating metrology process feedback into the manufacturing process is essential to:

Attaining a defect rate <100 ppb

Lowering excursion discovery time from weeks to days

Increasing learning during prototype ramp

Decreasing time to high-volume manufacturing (HVM)

Image Credit: Bruker Nano Surfaces and Metrology

Redefining X-Ray Defect Inspection

As X-Rays penetrate deeper into materials than light or electrons, they are an effective method for detecting defects that are not visible on the surface of a substrate. There are various types of X-Ray imaing (XRI), but the most common uses attenuation contrast to exploit material differences in X-Ray absorption coefficients.

Bruker has optimized X-Ray imaging with the X200 to make full defect inspection possible in-line on the manufacturing floor. Instead of pulling a small sample from the line for time-consuming and data-limited 3D X-Ray and cross-sectioning, 100% of production can be automatically monitored in real time for maximum quality, reliability, and yield.

Resolving Process Versus Defect

Defect detection does not require resolving each defect for visualization. The X200 continuously measures bump quality, which can be used for pass-fail qualification as well as binning for device performance and reliability.

Defect Screening

Use sensitive metrics to identify latent defects like solder necking, head-in-pillow, non-wet cracks, and other marginal bumps

Flag bump defects, including bridges, non-wets, and voids

Generate an automatic defect classification model for identifying failure modes quickly

Die tilt affecting bump height and causing non-wet defects. Image Credit: Bruker Nano Surfaces and Metrology.

The X200 can measure bump height, a predictive indicator of wetting behavior. This requires no cross-sectional or high-resolution defect imaging beyond initial validation step. Image Credit: Bruker Nano Surfaces and Metrology.

Die-Attach Process Control

To evaluate the quality of the die-attach process, evaluate each bump shape across the entire device

Provide corrective feedback to die-attach tools on process parameters, including die shift, rotation, height, tilt, and warpage

Die warpage can be intuitively represented in 3D by mapping bump heights, which can also be used to flag non-wet defects. Image Credit: Bruker Nano Surfaces and Metrology.

X200 Specifications

Source: Bruker Nano Surfaces and Metrology