Vacuum Chamber Cleaning System for TESCAN SEM/FIB: Evactron ES De-Contaminator

The ES De-Contaminator from Evactron is a high performance, compact, yet streamlined plasma cleaner designed for Tescan Ion and Electron Beam Instruments, like FIBs and SEMs.

The Evactron ES De-Contaminator can be cleaned easily, providing higher contrast imaging and resolution and also improving the sensitivity of probes and detectors that are otherwise affected by contamination.

The Evactron ES Plasma Radical Source has a compact design that makes it a multipurpose solution for load locks, FIB/SEM chambers, or sample preparation chambers. The Evactron ES Plasma Cleaner provides rapid, effectiveand mild cleaning across a broad range of pressures, allowing artifact-free, high quality images, as well as improved efficiency of sample analysis.

System Features

Energy efficient radiofrequency hollow cathode plasma

Dual action cleaning through plasma and UV afterglow

RF power—10 to 20 W at 13.56 MHz

A broad range pressure operation—1 Torr to 22 mTorr, or 133 Pa to 3 Pa

The Tescan GUI provides programmable power, cleaning time

High vacuum 'pop'ignition

Ensures rapid cleaning that is more than 60 times faster than the previous generation of Evactron versions

Compatible with TMP and does not require advance venting

Vacuum-safety interlock and external interlock connection (optional)

Push button cleaning operation

PRS can be set up on the load lock or the SEM chamber

Sensitive components are not damaged, as there is no sputter etch

Match or gas flow modifications are not required for plasma ignition

Complies to NRTL, TUV, CE, SEMIand RoHS standards

The Evactron ES Plasma De-Contaminator was specifically developed for OEM integration for high vacuum, FIB, SEMand other analytical systems. The streamlined Evactron Plasma Radical Source (PRS) has a small footprint and uses air plasma afterglow to decrease hydrocarbon contamination, providing fast and efficient results.

Image Credit: Evactron E50 (XEI Scientific)

Don’t let a fingerprint ruin your microscope session – use Evactron^® plasma cleaning.Fingerprints are one of the major sources of contamination in vacuum systems. Evactron dual-action turbo plasma cleaning™ expels these adventitious hydrocarbons for clean samples and chamber surfaces. Typically, vacuum chambers can be cleaned with the Turbo Plasma™ Cleaning process at turbo molecular pressures of 10^-2 to 10^-3 Torr with 2 - 10 minutes cleaning times to maintain pristine conditions. Vacuum levels return to normal operating pressures in < 20 minutes.

Specifications of Evactron ES System

Includes 2U rack-mount controller for system integration

FIB/SEM host-directed control

Compact Plasma Radical Source (PRS)

Hardware interlock (optional)

Offers 100 to 240 VAC and 50/60 Hz input

RF power—10 to 20 W at 13.56 MHz CCP

Complies to NRTL, TUV, CE, SEMIand RoHS standards