National Electronic Alloys Inc.
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The Beginning: In 1955 a group of innovative engineers started UniPunch in Niagara Falls, New York with what was then a new concept to more efficiently produce punches for modular bump dies known as “C-frame,” or “unitized” tooling. Our quality and service was such that customers asked us to expand our product line. As a result we quickly began not only providing complete bump dies but also designing complete punching and notching systems to meet our customers’ needs.
Primary Activity
Material Manufacturer
How Our Insight Makes A Difference In this industry, experience means a lot. It means an awarene……...
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