THEIA: R&D Scale Wafer Coating System

THEIA from Forge Nano integrates production-proven system components and design of the company’s commercial solution APOLLO, in an R&D package that offers unparalleled flexibility, performance, safetyand reliability.

THEIA is field-upgradable and thus can cater to the ever-changing requirements of engineers and scientists. THEIA allows a smooth transition from R&D to production. Recipes produced using THEIA can be fed to APOLLO to achieve a simple and direct path to commercial-scale production.

Key Features

Ultrafast deposition of 120–300 Å/minute

Scalable and field-upgradable

>1% uniformity between batches and across wafer

Proprietary valves with a speed of <1 msec and cycle lifetime of 100 million

Maintenance performed at 50-pm intervals

Applications

Development of ALD precursors

Environment barrier coatings

Adhesion and interface layers

Corrosion protection

Abrasion-resistant coatings

Area-selective chemistry development

Forge Nano delivers THEIA across the globe to power a new generation of advanced technologies. THEIA includes class-leading maintenance and world-class service, from the company’s dedicated team of U.S.-based scientists and engineers.

Basic Specifications and Configurations

Performance

THEIA offers ultrafast deposition powered by Forge Nano’s patented SMFD-ALD™, in a cost-effective system for R&D budgets. Sub-second ALD cycle times enable fast and efficient exploration of applications that require thick films.

The system covers difficult patterned substrates like advanced-generation DRAM device wafers, sensors, membranes, electron multipliers, etc. with aspect ratios of up to 1,000.

Capabilities

THEIA is best suited for the exploration of newly developed ALD precursors. During the initial stage, ALD precursors are usually very costly ($1,000/g being very usual) and are available only in small quantities.

Customers also benefit from the several mature high productivity ALD processes including Ta₂O₅, HfO₂, SiO₂, ZrO₂, Nb₃N₅, <300°C TiN, GaN, BNand many more, which Forge Nano delivers as turn-key processes.

Configuration

THEIA comes in three wafer size configurations (ranging from 75 to 300 mm) and a fourth configuration for general parts and/or panels measuring up to 300 x 300 x 10 mm. It is possible to retrofit all configurations in the field with flexible field-upgradable options.

Design

THEIA features Forge Nano’s millisecond response ALD manifold that combines 10 of its patented Fast Pneumatic Valves (FPV) to offer more than 100 million trouble-free cycles of nanolaminate and composite ALD films.

This ALD manifold is the only one that can shift composition every cycle without any throughput penalty. Forge Nano’s valves are field-proven since 2005 and have set records for lifetime, speed, safetyand reliability, while functioning at high temperatures of up to 220°C. ALD valves from Forge Nano are the only spill-free, doubly contained UHP valves available in the market.

Optional Features

In-Situ QCM monitors ALD processes with higher than 5% of a monolayer at millisecond time-resolution. It is used for elaborate mechanistic studies, optimization of ALD process, stability of precursorsand kinetics. Moreover, it is very useful for surface cleaning processes, de-chlorination, densification, precursor sublimation, reduction, nitridation, annealing, oxidation, silicide formationand many more.