The SURFACESCAN® QC-100: A Sequential Electrochemical Reduction Analysis (SERA) Analyzer

The potential to solder and wire bond is a crucial factor during the manufacture of reliable semiconductor packaging components and PCBs. Every miss-bonded component falls on the reject pile, either at the manufacturers’ plants or at their customers’ facilities.

Conventional methods, such as ESCA/Auger, SEM, Dip and Look, XRF, etc., tend to be costly, subjective, time intensive and are generally unreliable. Using the patented method, called Sequential Electrochemical Reduction Analysis (SERA), the SURFACESCAN^® QC-100 from ECI Technology quantifies the adhesion properties of the surface. Users can check if they are ready for bonding and if not, they will know why.

The SURFACESCAN^® QC-100 is a quick and low cost process and quality control tool that reveals the four significant reasons for rejects.

Key Features

Can analyze Ag, Cu, Co, Ni, Au, In, Sn, Bi, Pband Sb

Includes a corrosion-resistant test stand

Excellent for gold, copper, immersion tinand solder

Examines boards up to 15″x24″ (bigger sizes are optional)

Maintenance is low

A sealed reservoir is available for test solutions

Beam alignment for SMT or PHT pad positioning on the stand

Pre-programmed applications for numerous alternative surface finishes

Live surface fingerprint data-driven decision assists tools for review and troubleshooting of any abnormalities

Key Benefits

Coating Contamination

Detects possible issues on surface mount pads (SMT), plated through holes (PTH), lead framesand components

Non-destructive method eliminates sample preparation

Coating Uniformity

Exhibits coating thickness down to approximately 15Å

Detects and helps avoid oxidation to the underlying substrate

Immersion gold, copper oxide, tin, silver, nickel, or organic solderability preservative (OSP) coating porosity

Sn-Cu Intermetallic

The Tin Copper intermetallics are naturally brittle, causing a fracture in the solder. The QC-100 can identify and quantify the thicknesses of both Cu₃Sn and Cu₆Sn₅

Technical Specifications

Conforming standards: NFPA and CE

Dimensions: 330 (13″) width x 445 (18″) height x 419 mm (17″) depth

Data communication: Multiple communication protocols such as Serial, RS-232, TCP/IP, and SECS/GEM