The Role of STW-10 in Semiconductor Processing

The STW-10 automated plasma system has been crafted specifically for front-end semiconductor processing. It is the ideal tool for activating silicon surfaces prior to hybrid wafer bonding. The STW-10 accepts FOUPs containing 300 mm wafers or cassettes with dies on a tape frame. In terms of maximum throughput, the system can handle up to 60 wafers per hour.

Inside the STW-10, the Atomflo^™ plasma system forges a uniform, particle-free, electrically neutral discharge that ensures no damage to CMOS integrated circuits.The hydrogen/argon plasma removes metal oxidation from copper, tin, and indium,while the oxygen/argon plasma strips away organic contamination.

The STW-10 has all the requiredfeatures for effective modern semiconductor fabrication:

Carrier RFID or barcode recognition

Cleanroom class 10 (ISO 4)

EFEM prepared for OHT or AGV factory handling

Meets all SEMI standards

SECS/GEM ready

Wafer alignment and carrier mapping

Image Credit: Surfx Technologies, LLC

STW-10 Specifications

Wafer Size Options: 300 mm, 200 mm, 150 mm

Footprint (W * D * H): 2,024 × 2,900 × 2,180 mm, 79.7 × 114.2 × 85.8 inches

Product handling: FOUP, cassette, or both, Wafer, tape frame, or both

Patented plasma technology:

RF capacitive discharge

O₂, H₂, N₂ plasma chemistry

Atmospheric argon plasma

The STW-10 is developed for precise plasma cleaning of semiconductor wafers, ensuring low damage, outstanding dependability, and traceability.

Source: Surfx Technologies, LLC

Image Credit: Surfx Technologies, LLC