The QUALISURF® Series of Wet Process Chemical Monitoring Systems

上海仪舶实验室自动化 25-01-23 15:07:19

The QUALISURF® Series of Wet Process Chemical Monitoring Systems

Existing process demands for both 3D stacking and sophisticated transistors need wet process control beyond previous equipment abilities. The number of required selective chemical deposition steps is expanded by scaling down to MOL and the multilayers of BEOL.

Fast rollout from research and development to largescale manufacturing implies that wet chemical deposition equipment should be scalable, preciseandeconomical.

The QUALISURF® range of analyzers are completely automated online, inlineand benchtop chemical monitoring systems that can be configured for sophisticated etching and cleaning applications to accurately control the composition of metallization solutions, such as contaminants and additives in the sub-ppm level.

The QUALISURF platform has a flexible architecture that helps install different methods together to methodically carry out process controls, such as:

Qualify incoming wet chemistry

Chemical quality control for facilities and production floors

Advanced cleaning chemistries with multiple species

Multiple process tools can be supported

Process solutions can be tracked and optimized for reuse

User can reclaim or recycle chemistry for efficient process and to fulfill environmental and sustainability goals

Application Guide for QUALISURF Analyzers

Source: ECI Technology

Model

Process

Application

Benefit

QSF-100

BEOL

Diluted Ozone for silicon-germanium (SiGe) cleans

Integrated, point-of-use

QSF-200

BEOL

Clean & Etch PERR

W Contacts PERR

TiN Hard Mask Removal

AlOx/HMO Cleans

Continuous measurement of all critical components

Enables re-use of chemicals

Excellent performance for H2O2

QSF-200

FEOL

DSP+ Wall Residue Removal

ESL Removal

Mixing quality control, fab and facility

QSF-300

Materials Quality

Control/Facilitiesand WasteManagement

DSP+ Blend

Metal Contaminants

Waste Management

Qualifying incoming chemicals, critical to managing cost, yield and reliability at advanced design nodes

Tight control DSP+ mix concentrations

QSF-500

FEOL

Selective Si Etch with hot phosphoric acid (H3PO4) Trench Isolation

Spacing and Thinning

Bit-line

Patented method for Si, precise/efficient Si monitor

QSF-600i

Post CMPprocess

In-line chemical monitoring of chemical mixing and dilution systems

QSF-800

MOL

BEOL

Cobalt PERR

Control of all known components

Enables re-use of chemicals

QSF-900

FEOL

Sigma Anisotropic Etch (TMAH)

Si Etch

SiGe

GAA

Polysilicon Etch

Photoresist Strip, Removal and Rework

Multiple components are measured by NIR, <5 mins. per tank

Superior selectivity for Si Etch

QSF-W100

Advanced Packaging

UBM Copper Etching Reclaim

Enables re-use of chemicals

QSF-W200

Advanced Packaging

Photoresist Strip, Removal and Rework

Tight process control

Key Features

Enables spectroscopy integration and communication with all the process tools and the Fab host for closed-loop control

Uses recipe-based measurement and data analysis with both output and visualization of outcomes, with export in numerous data formats

Provides numerous recirculation line support for each chemistry

Provides comprehensive histories and current status of the tanks, and also displays SPC data without interrupting the automatic analysis sequence

Enables solution reclaim; leads to reduced costs because of less wastage

Automatic control and analysis of chemical components and species

A tank summary includes analysis data on each process chamber, as well as the standard data

The frequency of analysis can be defined by users and is based on the analytical technique and the chemistry

Unique, low maintenance electrodesand several integrated automated routines, allow simple diagnostics, maintenanceand troubleshooting

For result comparison, a separate history of SPC alarm messages and a chronological history of alarm messages are available

Numerous alarm indicators alert operators relating to problems in tanks or instruments

Key Benefits

Process Improvement

Quick characterization and analysis of process bath chemistry enable instant response and rectification to process conditions. Product yields are also increased by knowing a quantitative process composition.

Established reliability of 95% availability with an MTBF of more than 1000 hours*

A completely automated system makes use of programmable recipes for accurate control. Such recipes comprise steps for delays, sample extraction, composition replenishmentand purges to clean lines, thereby offering more process knowledge and precision for tighter process control.

Enables solution reclaim; leads to reduced costs due to less wastage.

Versatile

Numerous chemistries and process tools, such as detection of variations in incoming raw chemical supply, are sampled and analyzed

The modular design enables flexible configuration and thus enhances the uniformity and reproducibility of the process

Multi-channel abilities support all the tanks for a process tool

Can be configured for sub-fab setting

User-Friendly

Flexible software offers many viewing options

Software makes process control easy with alarm settings, status conditions, and online help

Reduced preventative maintenance requirements decrease the cost of consumables and can be readily fieldserviced

*Chemistry dependent

Technical Specifications

AC: 180 to 245 VAC 50/60 Hzand 15 A

Dimensions: 762 (30″) width x 1822 (71.75″) height x 610 (24″) depth

Bulk refill: Dry contact

Safety interlocks

Conforming standards: CE, NFPA 79, SEMIS2-S8and SEMI F47

Data communication: Numerous communication protocols such as Serial, RS-232, TCP/IPand SECS/GEM

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