DIL 832 - High Resolution True Differential™ Horizontal Push Rod Dilatometer
The DIL 832 is considered to be a high sensitivity optical encoder and TA exclusive True Differen……...
Existing process demands for both 3D stacking and sophisticated transistors need wet process control beyond previous equipment abilities. The number of required selective chemical deposition steps is expanded by scaling down to MOL and the multilayers of BEOL.
Fast rollout from research and development to largescale manufacturing implies that wet chemical deposition equipment should be scalable, preciseandeconomical.
The QUALISURF® range of analyzers are completely automated online, inlineand benchtop chemical monitoring systems that can be configured for sophisticated etching and cleaning applications to accurately control the composition of metallization solutions, such as contaminants and additives in the sub-ppm level.
The QUALISURF platform has a flexible architecture that helps install different methods together to methodically carry out process controls, such as:
Qualify incoming wet chemistry
Chemical quality control for facilities and production floors
Advanced cleaning chemistries with multiple species
Multiple process tools can be supported
Process solutions can be tracked and optimized for reuse
User can reclaim or recycle chemistry for efficient process and to fulfill environmental and sustainability goals
Application Guide for QUALISURF Analyzers
Source: ECI Technology
Model |
Process |
Application |
Benefit |
---|---|---|---|
QSF-100 |
BEOL |
Diluted Ozone for silicon-germanium (SiGe) cleans |
Integrated, point-of-use |
QSF-200 |
BEOL |
Clean & Etch PERR W Contacts PERR TiN Hard Mask Removal AlOx/HMO Cleans |
Continuous measurement of all critical components Enables re-use of chemicals Excellent performance for H2O2 |
QSF-200 |
FEOL |
DSP+ Wall Residue Removal ESL Removal |
Mixing quality control, fab and facility |
QSF-300 |
Materials Quality Control/Facilitiesand WasteManagement |
DSP+ Blend Metal Contaminants Waste Management |
Qualifying incoming chemicals, critical to managing cost, yield and reliability at advanced design nodes Tight control DSP+ mix concentrations |
QSF-500 |
FEOL |
Selective Si Etch with hot phosphoric acid (H3PO4) Trench Isolation Spacing and Thinning Bit-line |
Patented method for Si, precise/efficient Si monitor |
QSF-600i |
Post CMPprocess |
In-line chemical monitoring of chemical mixing and dilution systems |
|
QSF-800 |
MOL BEOL |
Cobalt PERR |
Control of all known components Enables re-use of chemicals |
QSF-900 |
FEOL |
Sigma Anisotropic Etch (TMAH) Si Etch SiGe GAA Polysilicon Etch Photoresist Strip, Removal and Rework |
Multiple components are measured by NIR, <5 mins. per tank Superior selectivity for Si Etch |
QSF-W100 |
Advanced Packaging |
UBM Copper Etching Reclaim |
Enables re-use of chemicals |
QSF-W200 |
Advanced Packaging |
Photoresist Strip, Removal and Rework |
Tight process control |
Key Features
Enables spectroscopy integration and communication with all the process tools and the Fab host for closed-loop control
Uses recipe-based measurement and data analysis with both output and visualization of outcomes, with export in numerous data formats
Provides numerous recirculation line support for each chemistry
Provides comprehensive histories and current status of the tanks, and also displays SPC data without interrupting the automatic analysis sequence
Enables solution reclaim; leads to reduced costs because of less wastage
Automatic control and analysis of chemical components and species
A tank summary includes analysis data on each process chamber, as well as the standard data
The frequency of analysis can be defined by users and is based on the analytical technique and the chemistry
Unique, low maintenance electrodesand several integrated automated routines, allow simple diagnostics, maintenanceand troubleshooting
For result comparison, a separate history of SPC alarm messages and a chronological history of alarm messages are available
Numerous alarm indicators alert operators relating to problems in tanks or instruments
Key Benefits
Process Improvement
Quick characterization and analysis of process bath chemistry enable instant response and rectification to process conditions. Product yields are also increased by knowing a quantitative process composition.
Established reliability of 95% availability with an MTBF of more than 1000 hours*
A completely automated system makes use of programmable recipes for accurate control. Such recipes comprise steps for delays, sample extraction, composition replenishmentand purges to clean lines, thereby offering more process knowledge and precision for tighter process control.
Enables solution reclaim; leads to reduced costs due to less wastage.
Versatile
Numerous chemistries and process tools, such as detection of variations in incoming raw chemical supply, are sampled and analyzed
The modular design enables flexible configuration and thus enhances the uniformity and reproducibility of the process
Multi-channel abilities support all the tanks for a process tool
Can be configured for sub-fab setting
User-Friendly
Flexible software offers many viewing options
Software makes process control easy with alarm settings, status conditions, and online help
Reduced preventative maintenance requirements decrease the cost of consumables and can be readily fieldserviced
*Chemistry dependent
Technical Specifications
AC: 180 to 245 VAC 50/60 Hzand 15 A
Dimensions: 762 (30″) width x 1822 (71.75″) height x 610 (24″) depth
Bulk refill: Dry contact
Safety interlocks
Conforming standards: CE, NFPA 79, SEMIS2-S8and SEMI F47
Data communication: Numerous communication protocols such as Serial, RS-232, TCP/IPand SECS/GEM
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