The NX5000: A Focused Ion Beam Scanning Electron Microscope (FIB-SEM)

Hitachi has introduced a high performance TripleBeam™ FIB-SEM—called NX5000—that enables excellent TEM lamella preparation and provides accurate cross-sectioning and 3D volume microscopy.

The built-in Ar⁺/Xe⁺ beam helps prepare uniform, ultra-thin, low damage TEM lamellae easily, even on the most complex materials.

Gentle, High-Precision Lamellae Finishing

Multi-directional milling eliminates curtaining

Flatter, thinner, widerand low damage lamellae can be made using the built-in Ar⁺/Xe⁺ broad beam

Ga⁺-induced damage is prevented

Image Credit: Hitachi High-Tech Europe

HighPerformance Imaging

Offers sub-nanometer resolution even at low kV

Fine structures can be clearly observed with the high performance, dual-mode SEM (field-free or immersion)

Users can get their required contrast at any time with the multi-mode STEM and the sensitive in-lens detectors

High Performance Ga⁺ Milling

Rapid FIB/SEM switching (Timesharing mode) allows live fabrication and observation with complete clarity

High throughput with beam currents of more than 100 nA

Unique Sample Handling Solutions

Specimens with up to 150 mm diameter can be rapidly exchanged via the load lock

Lamellae can be directly transferred to TEM under vacuum, using the built-in side entry rod holder

Double-tilt sub-stage provides more degrees of freedom for excellent milling geometry

Advanced Automation

The simple recipe creator automates lamella preparation, imaging, cross-section generation, etc.

Complex samples can be rapidly navigated with the CAD navigation system

Up to 20 TEM lamellae can be lifted out automatically