KYOCERA
Kyocera believes in the power of engineering and technology to change the world for the better. F……...
Hitachi has introduced a high performance TripleBeam™ FIB-SEM—called NX5000—that enables excellent TEM lamella preparation and provides accurate cross-sectioning and 3D volume microscopy.
The built-in Ar+/Xe+ beam helps prepare uniform, ultra-thin, low damage TEM lamellae easily, even on the most complex materials.
Gentle, High-Precision Lamellae Finishing
Multi-directional milling eliminates curtaining
Flatter, thinner, widerand low damage lamellae can be made using the built-in Ar+/Xe+ broad beam
Ga+-induced damage is prevented
Image Credit: Hitachi High-Tech Europe
HighPerformance Imaging
Offers sub-nanometer resolution even at low kV
Fine structures can be clearly observed with the high performance, dual-mode SEM (field-free or immersion)
Users can get their required contrast at any time with the multi-mode STEM and the sensitive in-lens detectors
High Performance Ga+ Milling
Rapid FIB/SEM switching (Timesharing mode) allows live fabrication and observation with complete clarity
High throughput with beam currents of more than 100 nA
Unique Sample Handling Solutions
Specimens with up to 150 mm diameter can be rapidly exchanged via the load lock
Lamellae can be directly transferred to TEM under vacuum, using the built-in side entry rod holder
Double-tilt sub-stage provides more degrees of freedom for excellent milling geometry
Advanced Automation
The simple recipe creator automates lamella preparation, imaging, cross-section generation, etc.
Complex samples can be rapidly navigated with the CAD navigation system
Up to 20 TEM lamellae can be lifted out automatically
Kyocera believes in the power of engineering and technology to change the world for the better. F……...
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