Epsilon 4: Benchtop Spectrometer for Lubricating Oils
Increasing the speed of engine tests while ensuring product quality is a vital industry requireme……...

In addition to everything in the Wafer Cleaving Kit (CSK-200M-LG), The Cleaving Station includes a 12” x 18” self-healing cutting mat, two diamond scribes for marking and scribing, one pen style diamond scribe, and cleaving pliers. The kit also includes the Lattice Scriber customized with an eight-point diamond scribe, suitable for scribing at any angle, and the LatticeGear small cleaving pliers that provide a clean cleave on both very small samples and samples as large as 300 mm.
Specifications
Diamond Scribe-pen style
Diamond Scribe-straight tip
Diamond Scribe-30° tip
Lattice Scriber diamond scriber customized with an 8-point diamond tip
Tweezers with black soft fiber fine tip (length 6 ¼”)
CleanBreak Pliers-wafer cleaving pliers; three sets of jaws (two running for crystalline substrate and 1 nipping for glass and ceramic)
Small Sample Cleaving Pliers (GC-SS-100)
Large 18” x 12” Cutting Mat-self healing, wafer cutting mat
Small ruler mat-self healing, small wafer piece ruler mat
Clear plastic ruler with metric and US units
Tungsten cleaving wire

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