The Advanced SC450 Sputtering System for Thin Film Vacuum Deposition Systems

Semicore’s SC450 sputtering system is a reliable, high-performance, cost-effective tool. The company’s engineering talent and design initiatives contribute effectively to the capabilities, quality, and essential economy of the SC450. Semicore designs and manufactures precision thin film vacuum deposition systems and products.

Features

The key features of the advanced SC450 sputtering system are as follows:

Fully automated, integrated controls

Active deposition area up to 200 mm (8”) diameter

Small volume, fast cycle processing

Multiple sources (up to 4)

Accommodates various substrates shape/sizes

Confocal cathode arrangement

Magnetron sources: 50 mm (2”), 75 mm (3”), or 100 mm (4”)

Sequential or co-deposition modes

Multiple process gas capability

DC, Pulse DC, RF (HF or MF) power supplies

Substrate; heating, cooling, RF/DC bias

Integral cathode shutter

In-situ cathode tilt

Advanced FastCycle Load-lock also available

R&D prototyping

Facilities Requirements

Process Gases

Up to 3 different gases

138 - 207 kPa (20 - 30 psi.)

¼” VCR-4 connection type

99.999% purity semiconductor grade

Clean Dry Air (Load lock or capacitance manometer option)

620 - 690 kPa (90 - 100 psi.)

¼” Swagelok^® connection type

Nitrogen Vent

13 - 207 kPa (2 - 30 psi)

¼” Swagelok^® connection type

99.999% purity semiconductor grade

Water

½” push fit connection type

13 - 27°C (55 - 80°F) water temperature

7.6 - 15 L/min (2.0 - 4.0 gpm)

207 kPa (30 psi.) delta min

552 kPa (80 psi.) max inlet pressure

Distilled water or Propylene Glycol mix

900 W - 2 kW cooling capacity required

Electrical

208 - 240 VAC

20 - 40 Ω

50/60 Hz

Single Phase