SCHNEEBERGER Holding AG
Founded in 1923, Schneeberger is now one of the leading names when it comes to groundbreaking inn……...

TESCAN UniTOM HR is the only micro-CT system that gives sub-micron spatial resolution and high temporal resolution dynamic CT in a single, extremely adaptable system.

Battery cathode foil imaged at 590 nm voxel resolution. Image Credit: TESCAN USA Inc.

Dynamic imaging of soap bubbles at 3.7 μm voxel size and 9.5 seconds temporal resolution. Image Credit: TESCAN USA Inc.

40 × 3 cm concrete core. 7 mm volume of interest scanned at 5 μm voxel size. Image Credit: TESCAN USA Inc.
Key Benefits:
Investigate the Smallest of Features with Spatial Resolution Down to 600 nm
Precision stages, high-quality detectorsand a cutting-edge nano-focus X-Ray source work in conjunction to produce images with a sub-micron resolution.
Perform True 4D Imaging with Dynamic CT
Synchrotron-like capabilities are brought to the lab through high temporal resolution, continuous and uninterrupted scanningand specific 4D software tools.
Implement 3D In Situ Experiments
In situ investigations can be conducted without interruption, thanks to continuous sample rotation and scanning. The experiment setup is made easier using dedicated “no-cable-wrap” interfaces.
Accommodate a Broad Range of Samples
UniTOM HR has a high-power source (50W), multiple detector options (up to three)and a heavy load stage (45 kg) that can handle samples up to 500 mm diameter × 700 mm high.
Maximize System Utilization and Throughput
A fast frame rate detector and a high flux X-Ray source integrate for high temporal resolution tomography offering the ability to scan more samples and accommodate more users.
Applications
Non-destructive 3D and 4D imaging with high throughput for materials research and engineering, failure analysisand quality assurance in a variety of applications, including:
Aerospace
Additive Manufacturing
Energy Conversion and Storage
Pharmaceutical
Automotive
Consumer Products and Packaging
Oil E&P
Food Science
Soil Sciences
Advanced Packaging for Electronics
Building Materials
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