STA-10 - Automated Plasma System

上海仪舶实验室自动化 25-01-23 12:54:49

STA-10 - Automated Plasma System

The STA-10iL automated plasma system is engineered to clean and activate substrates for enhanced adhesion, making it ideal for semiconductor packaging and electronics manufacturing. It features standard in-line conveyance for high-volume production, with an optional drawer available for high-mix, low-volume manufacturing needs.

Inside the STA-10iL, a three-axis gantry precisely applies advanced atmospheric plasma to your substrates. The system utilizes Surfx’s Atomflo controller, which operates with low-voltage radio frequency (RF) power to generate a uniform, particle-free, and electrically neutral plasma. This plasma is safe for use on even the most sensitive electronics.

Numerous solutions are available for in-line or batch production with complete traceability using the STA-10iL:

Inert gas purge for reducing gas chemistry

Substrate heating and cooling

Oxygen plasma for organic clean

Hydrogen plasma for metal oxide removal

Cleanroom class 100 (10,000 is standard)

STA-10 - Automated Plasma System

Image Credit: Surfx Technologies, LLC

STA-10iL Specifications

Work area (X * Y * Z): 550 × 760 × 60 mm

Footprint (W * D * H): 1,000 × 1,500 × 1,550 mm, 39.4 × 59.1 × 61.0 inches

Software and OS: Cloudbreak for quick development of programs

Patented plasma technology:

Atmospheric argon plasma

RF capacitive discharge

O2, H2, N2 plasma chemistry

The STA-10iL is specially made for single-part traceability, high dependability, and zero-damage precision plasma cleaning of semiconductors and other devices.

Source: Surfx Technologies, LLC

Specifications
Power supply 200~240 VAC, 31 A, 50/60 Hz
Air supply (CDA) 0.4-0.6 MPa (60-90 psig), <280 LPM (<10 CFM)
Footprint (W*D*H) 1,000 x 1,500 x 1,550 mm (39.4 x 59.1 x 61.0 inches)
Weight 1,050 kg (2,315 lbs)
Exhaust (flange, factory flow required) 100mm (4inch), 500 CMH (300 CFM)
Motion system
Work area (X * Y * Z) 550 x 760 x 60 mm
X Y Z repeatability XY: +/- 0.025 mm @ 3 sigma, Z: +/- 0.005 mm @ 3 sigma
Max speed 1,000 mm/s (X, Y)
Acceleration 1.0 g
Drive system AC servo & precision ground ball screw
Machine specifications
Conveyor type and payload Belt, 3 kg (6.6 lbs)
Trafficking communication SMEMA
Software and OS Cloudbreak operating on Windows 10
Max top and bottom side clearance 25 mm (1.0 inch)
Atomflo plasma specifications
RF Power 600 W at 27.12 MHz
Main plasma gas Argon (Ar)
Process gases Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar)
Process specifications
Nominal contact angle after plasma WCA < 10⁰ (native oxide on silicon wafer)
Plasma cleaning process O2 + Ar to remove organics, or H2 + Ar to remove metal oxidation

STA-10 - Automated Plasma System

Image Credit: Surfx Technologies, LLC

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