AIM Specialty Materials
AIM Specialty Materials has been a leading manufacturer of high-quality metals and chemistries si……...
The STA-10iL automated plasma system is engineered to clean and activate substrates for enhanced adhesion, making it ideal for semiconductor packaging and electronics manufacturing. It features standard in-line conveyance for high-volume production, with an optional drawer available for high-mix, low-volume manufacturing needs.
Inside the STA-10iL, a three-axis gantry precisely applies advanced atmospheric plasma to your substrates. The system utilizes Surfx’s Atomflo™ controller, which operates with low-voltage radio frequency (RF) power to generate a uniform, particle-free, and electrically neutral plasma. This plasma is safe for use on even the most sensitive electronics.
Numerous solutions are available for in-line or batch production with complete traceability using the STA-10iL:
Inert gas purge for reducing gas chemistry
Substrate heating and cooling
Oxygen plasma for organic clean
Hydrogen plasma for metal oxide removal
Cleanroom class 100 (10,000 is standard)
Image Credit: Surfx Technologies, LLC
STA-10iL Specifications
Work area (X * Y * Z): 550 × 760 × 60 mm
Footprint (W * D * H): 1,000 × 1,500 × 1,550 mm, 39.4 × 59.1 × 61.0 inches
Software and OS: Cloudbreak™ for quick development of programs
Patented plasma technology:
Atmospheric argon plasma
RF capacitive discharge
O2, H2, N2 plasma chemistry
The STA-10iL is specially made for single-part traceability, high dependability, and zero-damage precision plasma cleaning of semiconductors and other devices.
Source: Surfx Technologies, LLC
Specifications | |
---|---|
Power supply | 200~240 VAC, 31 A, 50/60 Hz |
Air supply (CDA) | 0.4-0.6 MPa (60-90 psig), <280 LPM (<10 CFM) |
Footprint (W*D*H) | 1,000 x 1,500 x 1,550 mm (39.4 x 59.1 x 61.0 inches) |
Weight | 1,050 kg (2,315 lbs) |
Exhaust (flange, factory flow required) | 100mm (4inch), 500 CMH (300 CFM) |
Motion system | |
Work area (X * Y * Z) | 550 x 760 x 60 mm |
X Y Z repeatability | XY: +/- 0.025 mm @ 3 sigma, Z: +/- 0.005 mm @ 3 sigma |
Max speed | 1,000 mm/s (X, Y) |
Acceleration | 1.0 g |
Drive system | AC servo & precision ground ball screw |
Machine specifications | |
Conveyor type and payload | Belt, 3 kg (6.6 lbs) |
Trafficking communication | SMEMA |
Software and OS | Cloudbreak™ operating on Windows 10 |
Max top and bottom side clearance | 25 mm (1.0 inch) |
Atomflo™ plasma specifications | |
RF Power | 600 W at 27.12 MHz |
Main plasma gas | Argon (Ar) |
Process gases | Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar) |
Process specifications | |
Nominal contact angle after plasma | WCA < 10⁰ (native oxide on silicon wafer) |
Plasma cleaning process | O2 + Ar to remove organics, or H2 + Ar to remove metal oxidation |
Image Credit: Surfx Technologies, LLC
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