TruVu 360™ Enterprise Fluid Intelligence Platform
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SPS-M: A Spot Plasma Source
The SPS-M is a spot plasma source developed for cleaning and activating substrates to enhance adhesion. It is perfectfor electronics manufacturing and semiconductor packaging.
The Surfx AtomfloTM600 controller powers the SPS-M plasma source by delivering radio frequency (RF)power, argon gas flow at 10 LPM, and 1.0 % hydrogen, oxygen, or nitrogen. The head's temperature is regulated through liquid cooling to maintain consistency. When activated, the system generates a uniform, electronically neutral, and particle-freeplasma beam that fills the 2 mm aperture, bathing the substrate in a flow of active hydrogen, oxygen, ornitrogen.
SPS-M Specifications
Plasma Beam Size
2 mm
Dimensions (W × D × H)
2.99 × 2.24 × 5.91 inches
76 × 57 × 150 mm
Weight
0.45 kg (1.0 lbs)
Patented Plasma Technology
RF capacitive discharge
Atmospheric argon plasma
O2, H2, N2 plasma chemistry
SPS-M
The SPS series plasma sources are specifically developedfor precise, low-temperature surface treatment of materials, ensuring no particle addition or damage.
Source: Surfx Technologies, LLC
| Specifications | |
|---|---|
| Plasma aperture diameter | 2 mm |
| Plasma effective diameter at substrate | 10 mm |
| External dimensions (W*D*H) | 76 x 57 x 150 mm (2.99 x 2.24 x 5.91 inches) |
| Weight | 0.45 kg (1.0 lbs) |
| Maximum RF power | 270 W at 27.12 MHz |
| Plasma gas | Argon (Ar) |
| Process gases | Oxygen (O2), nitrogen (N2), or hydrogen (5.0 % H2 in Ar) |
Image Credit: Surfx Technologies, LLC
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