SPS-M: A Spot Plasma Source

The SPS-M is a spot plasma source developed for cleaning and activating substrates to enhance adhesion. It is perfectfor electronics manufacturing and semiconductor packaging.

The Surfx Atomflo^TM600 controller powers the SPS-M plasma source by delivering radio frequency (RF)power, argon gas flow at 10 LPM, and 1.0 % hydrogen, oxygen, or nitrogen. The head's temperature is regulated through liquid cooling to maintain consistency. When activated, the system generates a uniform, electronically neutral, and particle-freeplasma beam that fills the 2 mm aperture, bathing the substrate in a flow of active hydrogen, oxygen, ornitrogen.

SPS-M Specifications

Plasma Beam Size

2 mm

Dimensions (W × D × H)

2.99 × 2.24 × 5.91 inches

76 × 57 × 150 mm

Weight

0.45 kg (1.0 lbs)

Patented Plasma Technology

RF capacitive discharge

Atmospheric argon plasma

O₂, H₂, N₂ plasma chemistry

SPS-M

The SPS series plasma sources are specifically developedfor precise, low-temperature surface treatment of materials, ensuring no particle addition or damage.

Source: Surfx Technologies, LLC

Image Credit: Surfx Technologies, LLC