SET Corporation SA

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

As a supplier of semiconductor equipment dedicated to high precision applications for over 40 years, SET has developed more than 34 different types of equipment. With more than 300 Device Bonders installed worldwide in more than 30 countries, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.

First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.