Samsung Techwin

Samsung Techwin has secured worldclass competitiveness within the core parts and module areas, which are the foundation of the IT industry. Samsung Techwin heads technological advancements for leadframes and flexible substrate areas, making market domination a possibility. Samsung Techwin is also producing high-quality mobile phone cameras that rival the picture quality and functionality of digital cameras. Micro Device solutions assimilate core module technology such as imaging, communication, and electrical power, to develop new micro computing chips. These devices are packed with SiP(System in Package) technology ranging in sensing, network, signal processing, control and low electrical energy.

Primary Activity

Material Manufacturer