Remtec, Inc.

Remtec was founded in 1990 to serve a growing need in advanced ceramic packaging technology for the electronics industry, primarily for high power and circuit density applications, covering a broad frequency range.

We manufacture Custom Metalized Ceramic Substrates, Chip Carriers and Packages for Power & Microwave /RF applications using our Plated Copper on to Thick Film (PCTF) technology. PCTFR technology successfully combines elements of plating technology with thick film and thin film processing to provide customers with optimal solutions for their packaging needs.

Remtec services a broad range of industries from telecommunications and computers to power supplies, electro-optical, laser and medical electronics, covering military, industrial and commercial range applications. Typical applications include RF power amplifiers and LNA¡¦s, optical switches, LED, filters, high-density DC/DC converters, driver circuits, thermoelectric coolers, power hybrids, power modules, smart power, power packages, chip carriers and other power assemblies.