QUALI-FILL® LIBRA: A Chemical Management System for Advanced Packaging and Electroplating

The new QUALI-FILL^® LIBRA online standalone metrology systems from ECI Technology have been specifically engineered to quantify material properties like Ni, Cu, SnAgand other crucial chemical species in plating solutions used for wafer packaging and other applications.

The QUALI-FILL^® LIBRA system has a modular design and can be configured to fulfill users’ demands. Developed based on ECI’s established QUALI-FILL^® chemical management platform, this sturdy system easily combines with R&D and production fabrications and is in compliance with the latest SECS/GEM and safety guidelines.

The QUALI-FILL^® LIBRA K series takes metrology performance to an ultra-safe and ultra-clean wafer fabrication environment. It helps monitor plating chemicals used for wafer level packaging processes like TSV, RDL, UBMand Micro Bumping processes like fan-out, SOC, and others.

The QUALI-FILL^® LIBRA A system has been developed for the tough settings of printed circuit board manufacturing. It is exclusively designed for analyzing plating chemicals in PLP and PCB manufacturing, like Electroplated Ni, Cu, Au, Pd, Snand Sn-alloys, as well as Electroless Ni, Cu, Pd, Auand Zincate.

The smart QUALI-DOSE system combines easily with QUALI-FILL LIBRA systems to accurately dose plating baths with replenishing solutions.

Breakdown products. Source: ECI Technology

Main Features

Versatile, modular design supports various types of manufacturing lines

Includes several analytical techniques to find and quantify the concentrations of crucial chemical species

Parallel close-loop integration to several plating process tools

Parallel analysis of various chemistries

Users can communicate with fabrications CIM via SECS/GEM

Multiple tanks can be supported for each chemistry

Main Benefits

The main advantages of the QUALI-FILL LIBRA analyzers are their patented and proprietary methods to detect and quantify contaminants like photoresist, additive by-productsand trace foreign metals. Such contaminants have an impact on the plating results and are crucial to managing the quality of the plated products.

The system monitors and allows process understanding of control process solutions and waste streams for treatment or recycling

Intelligent dosing capabilities help tighten the process

Unprecedented repeatability and accuracy can be ensured by using minimal, cost effective reagent solutions. High value analyses can be performed with low consumables and low cost per analysis.

ECI offers fast development times for brand new chemistries

Flexible configurations with an extensive range of applications

Technical Specifications

Conforming standards: CE, NFPA-79, SEMI F47, SEMI S2-S8, KRWA

Dimensions:

1 cabinet: 762 mm (30″) W x 2064 mm (81.2″) H x 610 mm (24″) D

2 cabinets: 1524 mm (60″) W x 2064 mm (81.2″) H x 610 mm (24″) D

3 cabinets: 2286 mm (90″) W x 2064 mm (81.2″) H x 610 mm (24″) D

AC: 180 to 245 VAC, 50/60 Hz, 15 A

Data communication: Multiple communication protocols— TCP/IP, Serial, SECS/GEM, RS-232



Image Credit: ECI Technology