[db:国别翻译]英国王王
阿乐斯专注于技术设备隔热材料、用于声学和轻量化应用的高性能泡沫、再生PET产品、新一代气凝胶技术以……...
TESCAN SOLARIS X extends the capabilities of FIB physical failure analysis to large-area and deep cross-sectioning (up to 1 mm) of packaged microelectromechanical and optoelectronic devices, by combining the high-throughput i-FIB+™ Xe plasma FIB column with the next generation tripleobjective Triglav™ electron column.
Xe plasma FIB milling enables large-volume bulk material removal without the drawbacks of the traditionally used methods, which are often time-consuming, broadly destructive, dependent on operator skill, and can induce new heat/mechanical artifacts. Ion implantation and interaction volume of Xe ions is significantly smaller than those of Ga ions. In addition, the inert nature of Xe ions prevents the formation of intermetallic compounds that can result in changes to the physical properties of the specimen and interfere with electrical measurements.
The Triglav™ SEM column features TESCAN’s proprietary triple objective TriLens™. This immersion-type ultra-highresolution lens is ideal for imaging beam sensitive materials at low landing voltages. The field-free high-resolution analytical lens provides large field of view for smooth, fast, and easy navigation across a sample, plus live monitoring of FIB operations. The third objective lens enables a variety of display modes, and spot shape optimization at high electron beam currents to improve microanalysis spatial resolution.
The in-column detection system features TriSE™ and TriBE™ to enable optimization of secondary and backscattered electron contrast methods by take-off angle, thus maximizing information from the sample. In addition, surface sensitivity of backscattered electron acquisition can be enhanced by energy-filtering.
The TESCAN Essence™ graphical user interface, which includes the vector based DrawBeam™ FIB pattern generator utility, can be customized for specific application workflows and to accommodate user skill and/or preferences. Furthermore, a choice of software modules, wizards and recipes make FIB-SEM applications an easy and straightforward experience for both novice and expert users.
Key Benefits
Artifact free large-area cross-sectioning for physical failure analysis of advanced packaging technologies Prepare large area FIB cross sections up to 1 mm in width
Obtain low noise, low kV SEM images with fast acquisition times, even while the sample is tilted
Live SEM monitoring during FIB milling for precise end-pointing at beam coincidence point
Selective secondary and backscattered electron contrast methods with in-column TriSE™ and TriBE™ detectors
Effective techniques and recipes for fast, artifact-free high current cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics)
Essence™ easy-to-use modular user interface
阿乐斯专注于技术设备隔热材料、用于声学和轻量化应用的高性能泡沫、再生PET产品、新一代气凝胶技术以……...
/9-9-I-9M-9M-9-9A-9-9G-9G-9E-1/ Thermo Scientific是分析工具的世界领导者。 我们的仪器解决方案使……...
The CoreAFM is the outcome of smartly integrating the core components of AFM to achieve utmost fl……...
Manufacturing Long-Lasting Industrial pH Sensors, ORP sensors, Ion Selective Sensors & Conduc……...
For the conventional pilot hole drilling and afterwards reaming operation in the raise boring ind……...
Technical Associates was founded in 1946 as a spin-off of the Manhattan Project.TA’s founde……...
Item North America is a premier provider of precision ball screws for use as a drive mechanism in linear slides, multi-axis motion and complex material handling devices. item ball screws feature hi……
SurPASS™ 3 is capable of measuring the zeta potential over an extensive range of materials and allows the analysis of varied surface properties and their changes. The zeta potential explains ……
AHP Materials is a specialty materials company focused on the manufacturing and selling of high purity specialty metals and compounds. AHP concentrates mainly on Antimony, Cadmium Sulfide, Telluriu……