Plasma De-Contaminator for UHV Chambers: Evactron® U50

The Evactron U50 Plasma De-Contaminator is a compact, simple plasma cleaner featuring high performance for chambers and instruments engineered to function at UHV conditions. The U50 offers high power cleaning to eliminatehydrocarbon contamination on sample and chamber surfaces.

The Evactron U50 De-Contaminator has been engineered for facilities that choose to use a wired touchpad interface to program cleaning parameters. An RS-232 cable is used to connect the touchpad (with dimensions of 134 × 112 × 69 mm) to the controller.

With a compact footprint, the simplified PRS makes use of UV afterglow and air plasma to minimize hydrocarbon contamination, delivering results quickly.

The design of the Evactron U50 Plasma Radical Source (PRS) is compact, making it a universal solution for sample prep chambers, load locks, or instrument chambers. The Evactron U50 provides effective, quickand robust cleaning across an extensive range of pressures, thus facilitating fast pumpdown time to UHV and hydrocarbon-free RGA spectra.

Image Credit: Evactron (XEI Scientific)

Image Credit: Evactron (XEI Scientific)

Image Credit: Evactron (XEI Scientific)

Use Evactron^® cleaning with H₂Ar or H₂N for Reductive Chemistries. If alternate gases are needed to clean ruthenium-coated sapphire mirrors or any surface sensitive to oxidation, Evactron dual action turbo plasma cleaning™ removes hydrocarbon deposits without incurring sputter damage or debris. Oxygen containing gases have a significantly higher hydrocarbon removal rate but also come with some potentially unwanted side effects such as oxidation of silver and copper.

System Features

RF Power of 75 W peak and up to 50 W continuous

Dual-action cleaning withplasma and UV afterglow

Energy-efficient radio frequency hollow cathode plasma (RFHC)

UHV compatibility ensured by Conflat 2.75 flange

Recipes, power, number of cyclesand cleaning time are programmable

Tethered touchpad command communications module

Broad range of pressure operation: 0.3 Pa/2 mTorr to 80 Pa/600 mTorr

Can be baked to 150°C

TMP-compatible, without any need for advance venting

Quick cleaning—more than 100 times faster than previous generation Evactron models

Zero sputter etch avoids damage to sensitive components

Leak tested to <10⁻¹¹ Torr or 10⁻¹¹ mBar (1.3E⁻⁹ Pa)

Push-button cleaning operation

Match or gas flow adjustments are not required for plasma ignition

Compliant with CE, NRTL, RoHS, SEMIand TUV

Evactron U50 System Specifications

Evactron U50 plasma radical source

Hardware interlock

Desktop controller with pushbutton operation

100–240 VAC 50/60 Hz input

Tethered touchpad communication package

RF Power—35 to 75 Watts at 13.56 MHz RFHC

Chassis dimensions—W × H × D: 17.2″ × 3.5″ × 8.6″ (44 × 8.9 × 22 cm)

Compliant with CE, NRTL, RoHS, SEMIand TUV