NX5000: A High-Performance Scanning Electron Microscope

Hitachi’s NX5000 is a high performance TripleBeam™ FIB-SEM that allows the best-in-class TEM lamella preparation and provides accurate cross-sectioning and 3D volume microscopy.

With the built-in Ar⁺/Xe⁺ beam, users can easily prepare uniform, ultra-thin, low damage TEM lamellae even on the most complex materials.

Gentle, High Precision Lamellae Finishing

Thinner, flatter, widerand lower damage lamellae can be made with the built-in Ar⁺/Xe⁺ broad beam

Ga⁺-induced damage is prevented

Multi-directional milling eliminates curtaining issues

Image Credit: Hitachi High-Tech Europe

High Performance Imaging

Allows sub-nanometer resolution even at low kV

Fine structures can be clearly visualized with the high performance, dual-mode SEM (field-free or immersion)

The multi-mode STEM and the sensitive in-lens detectors allow users to achieve their preferred contrast at any time

High Performance Ga⁺Milling

Rapid FIB/SEM switching (Timesharing mode) allows live fabrication and observation with complete clarity

High throughput with more than 100 nA beam currents

Unique Sample-Handling Solutions

Thanks to the built-in side entry rod holder, lamellae can be directly transferred to TEM under vacuum

Double-tilt sub-stage provides more degrees of freedom for excellent milling geometry

Samples can be rapidly exchanged with up to a 150-mm diameter via the load lock

Advanced Automation

Complex specimens can be quickly navigated with the CAD navigation system

The simple recipe creator automates lamella preparation, imaging, cross-section generation, etc.

Up to 20 TEM lamellae can be automatically lifted out