Nordson DAGE

Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Dage was acquired by the Nordson Corporation in 2006.

Nordson DAGE has a strong portfolio of award winning products for destructive and non-destructive mechanical testing and inspection of electronic components. It has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the USA, and maintains representative offices in other territories.

With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGA, Chip Scale Packages (CSP) and other electronic components. More recently Nordson DAGE has been heavily involved in the testing of the newest technology 300 mm wafer bump shear.

Nordson DAGE has developed an excellent suite of award-winning X-ray inspection equipment targeted at both the Semiconductor and PCBA markets.

Control of the patented core technology of X-ray tube manufacture ensures that the high-resolution X-ray will detect, identify and measure even the smallest of features. Nordson DAGE's high precision, state-of-the-art inspection equipment when joined with their sophisticated software offerings, ensure that the equipment is simple to use.

Our core strategy:

To support our customers wherever they do business,

To continually develop new products that provide its customers with enhanced competitive advantages,

To develop products which bring new advantages to its customer base

To control the core technologies that underpin its products.