Nexview™ 650: Coherence Scanning Interferometry

上海仪舶实验室自动化 25-02-05 10:27:55

Nexview™ 650: Coherence Scanning Interferometry

For automated measurement of injection molding tools, PCBs, glass panels, and other samples needing an increased work volume up to 650 × 650 mm, the NexviewTM 650 metrology system can be used as an inspection tool. It offers sub-micron lateral and sub-nanometer vertical precision in 2D and 3D measurements of a range of surface properties.

Powerful Performance

The measurement technology that forms the basis of the NexviewTM 650 system is Coherence Scanning Interferometry (CSI).

This non-contact technique offers the following high-precision, high-value surface metrology benefits:

Measures almost any surface, from extremely smooth to extremely rough, including thin films, steep slopes, and enormous steps.

Precision of sub-nanometer measurements is unaffected by field magnification.

Gage-capable performance: Outstanding accuracy and consistency for the most demanding manufacturing uses.

Vibrant operation in almost any setting, thanks to SureScanTM vibration tolerance technology.

The seamless data exchange with other ZYGO Profilers, such as ZeGageTM Pro, NewViewTM 9000, and NexviewTM NX2, is made possible by the MxTM software.

Maximize ROI

The NexviewTM 650 system has been carefully crafted to guarantee that it will continue delivering value for many years. For large samples that need precise 3D optical profiling, the NexviewTM 650 offers the most flexibility with a metrology area that can accommodate lateral dimensions up to 650 × 650 mm and sample loads of >100 kg, a vertical range of 150 mm, and options for a fully or partially enclosed system.

For instance, the system accommodates:

Common PCB substrate panel sizes used today

Customized sample holders for flexible sheets, etc. that can be used on the high load Y stage without causing too much mass worry.

Big, heavy injection molding plates that benefit from accurate non-contact inspection to reduce the possibility of exact surface damage.

To optimize application versatility, the system can be modified to accommodate smaller panels or singulated substrates using specially built chucks and sample holders that the user supplies.

The system's built-in recipe-driven automation software also allows for hands-free metrology of several aspects on each panel from a single workstation, which speeds up production and improves process understanding.

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