High-Precision Creep Testing Machine - Kappa Series
Electromechanical Creep Testing Machines Kappa SS The Kappa SS creep-testing machine is fitted w……...
MTBSolutions (MTBS) develops and licenses scalable bandwidth packaging technologies that enable semiconductor devices to keep pace with faster generations of chip applications. MTBS packaging technology has boosted the performance of a variety of devices to deliver significantly more functionality and speed over conventional package performance. MTBS package designs and process developments can deliver up to 40GHz bandwidth in both low pin count and high I/O formats. Leveraging our ability to successfully apply highly evolved technology to package design, materials selection, process design, manufacturing and testing, we have extended these capabilities into the RF, photonics and MEMS industries.
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Electromechanical Creep Testing Machines Kappa SS The Kappa SS creep-testing machine is fitted w……...
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