Improve Substrate Adhesion with the SPS-100 Plasma Source

The SPS-100 from Surfx Technologies is a linear beam plasma source developed for cleaning and activating substrates to enhance adhesion. It is suitable for electronics manufacturing and semiconductor packaging.

The Surfx Atomflo^TM600 controller powers the SPS-100 linear plasma source by supplying radio frequency (RF)power, argon gas flow at 32 LPM, and 1.0 % hydrogen, oxygen, or hydrogen. Liquid temperature control is maintained through the head to ensure consistency. When activated, the system produces an electrically neutral, particle-free, uniformplasma beam that fillsthe100-mm-wide slit, bathing the substrate in a flow of active hydrogen, nitrogen, or oxygenatoms.

Image Credit: Surfx Technologies, LLC

SPS-100 Specifications

Plasma Beam Size

100 mm (4.0 inches)

Dimensions (W × D × H)

6.67 × 1.26 × 3.397 inches

169 × 32 × 101 mm

Weight

0.8 kg (1.75 lbs)

Patented Plasma Technology

Atmospheric argon plasma

RF capacitive discharge

O₂, H₂, N₂ plasma chemistry

SPS-100

The SPS series plasma sources are engineered for precise surface treatment of materials at low temperatures, ensuring zero damage and no particle addition.

Source: Surfx Technologies, LLC

Image Credit: Surfx Technologies, LLC