Benchtop Sectioning Machine - SX100M Series
The latest sectioning machine to enter the LECO lineup is the efficient benchtop SX100M. It is a ……...
Improve Substrate Adhesion with the SPS-100 Plasma Source
The SPS-100 from Surfx Technologies is a linear beam plasma source developed for cleaning and activating substrates to enhance adhesion. It is suitable for electronics manufacturing and semiconductor packaging.
The Surfx AtomfloTM600 controller powers the SPS-100 linear plasma source by supplying radio frequency (RF)power, argon gas flow at 32 LPM, and 1.0 % hydrogen, oxygen, or hydrogen. Liquid temperature control is maintained through the head to ensure consistency. When activated, the system produces an electrically neutral, particle-free, uniformplasma beam that fillsthe100-mm-wide slit, bathing the substrate in a flow of active hydrogen, nitrogen, or oxygenatoms.
Image Credit: Surfx Technologies, LLC
SPS-100 Specifications
Plasma Beam Size
100 mm (4.0 inches)
Dimensions (W × D × H)
6.67 × 1.26 × 3.397 inches
169 × 32 × 101 mm
Weight
0.8 kg (1.75 lbs)
Patented Plasma Technology
Atmospheric argon plasma
RF capacitive discharge
O2, H2, N2 plasma chemistry
SPS-100
The SPS series plasma sources are engineered for precise surface treatment of materials at low temperatures, ensuring zero damage and no particle addition.
Source: Surfx Technologies, LLC
| Specifications | |
|---|---|
| Plasma beam | width 100 mm (4.0 inches) |
| External dimensions (W*D*H) | 169 x 32 x 101 mm (6.66 x 1.26 x 3.97 inches) |
| Weight | 0.8 kg (1.75 lbs) |
| Maximum RF power | 600 W at 27.12 MHz |
| Plasma gas | Argon (Ar) |
| Process gases | Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar) |
Image Credit: Surfx Technologies, LLC
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