Improve Substrate Adhesion with the SPS-100 Plasma Source

上海仪舶实验室自动化 25-01-23 13:46:34

Improve Substrate Adhesion with the SPS-100 Plasma Source

The SPS-100 from Surfx Technologies is a linear beam plasma source developed for cleaning and activating substrates to enhance adhesion. It is suitable for electronics manufacturing and semiconductor packaging.

The Surfx AtomfloTM600 controller powers the SPS-100 linear plasma source by supplying radio frequency (RF)power, argon gas flow at 32 LPM, and 1.0 % hydrogen, oxygen, or hydrogen. Liquid temperature control is maintained through the head to ensure consistency. When activated, the system produces an electrically neutral, particle-free, uniformplasma beam that fillsthe100-mm-wide slit, bathing the substrate in a flow of active hydrogen, nitrogen, or oxygenatoms.

Improve Substrate Adhesion with the SPS-100 Plasma Source

Image Credit: Surfx Technologies, LLC

SPS-100 Specifications

Plasma Beam Size

100 mm (4.0 inches)

Dimensions (W × D × H)

6.67 × 1.26 × 3.397 inches

169 × 32 × 101 mm

Weight

0.8 kg (1.75 lbs)

Patented Plasma Technology

Atmospheric argon plasma

RF capacitive discharge

O2, H2, N2 plasma chemistry

SPS-100

The SPS series plasma sources are engineered for precise surface treatment of materials at low temperatures, ensuring zero damage and no particle addition.

Source: Surfx Technologies, LLC

Specifications
Plasma beam width 100 mm (4.0 inches)
External dimensions (W*D*H) 169 x 32 x 101 mm (6.66 x 1.26 x 3.97 inches)
Weight 0.8 kg (1.75 lbs)
Maximum RF power 600 W at 27.12 MHz
Plasma gas Argon (Ar)
Process gases Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar)

Improve Substrate Adhesion with the SPS-100 Plasma Source

Image Credit: Surfx Technologies, LLC

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