Gage-Capable ContourSP Large Panel Metrology System from Bruker

PCB manufacturers are developing denser and small features on highly thin high-density interconnect (HDI) and multi-chip module (MCM) substrates.

The gage-capable ContourSP Large Panel Metrology System from Bruker is particularly designed for measuring each PCB panel layer during manufacture assuring the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production.

Key Features

The key features of the gage-capable ContourSP Large Panel Metrology System from Bruker are:

Unique Capabilities for excellent productivity

Highest throughput, more than two times faster than previous generation systems

Dynamic signal segmentation (DSS)

Remeasure function

Topography scanning to compensate for wafer bow

Easy coordinate file import, active ESD protection

Operator Access Control based on Vision64^®

Recipe portability for multi-tool and multi-factory deployment

Fully automated, non-contact, high-throughput, 3D HDI/PCB surface characterization; analysis library: Ra roughness, trace, via,pad clearance, dimple, anchor, overlay, soldermask, including via analysis for fiber-reinforced PCBs and thick film

Full- and semiautomatic remeasure functions; easy-to-use production mode with built-in databasing and pass/fail for any parameter optional stitching, MATLAB^®/TCPIP, thick film, SureVision; optional COGNEX vision/recognition system; FixSure™ custom fixture designs for panels with up to 6mm warpage/bow

Comprehensive PCB-HDI-MCM panel and thick film analysis suite; Vision64 3D optical measurement and analysis software; Microsoft^® Windows 7^® 64-bit O/S

Advanced multi-core Intel processor PC with dual RAID1 drives; keyboard, mouse, joystick box for XY axis and Z focus control;

23 in. flat panel monitor mounted on Ergotron^® support unit