Va-Tran Systems, Inc.
Va-Tran Systems is the established leader in CO2 precision cleaning and CO2 purification and dist……...
The U50 Plasma De-Contaminator from Evactron is a smalland simple plasma cleaner that features high performance for instruments and chambers designed to work at UHV conditions. The U50 provides high power cleaning to remove hydrocarbon contamination from chamber and sample surfaces.
The Evactron U50 De-Contaminator has been designed particularly for facilities that opt to make use of a wired touchpad interface to program cleaning parameters. An RS-232 cable links the touchpad (with dimensions of 134 × 112 × 69 mm) with the controller.
The streamlined PRS has a compact footprint and uses air plasma and UV afterglow to decrease hydrocarbon contamination, thus quickly providing the results.
The Evactron U50 Plasma Radical Source (PRS) has a compact design, which makes it a versatile solution for instrument chambers, sample prep chambers, or load locks. The Evactron U50 offers robust, rapidand effective cleaning throughout a comprehensive range of pressures, thereby enabling quick pumpdown time to UHV and hydrocarbon-free RGA spectra.
Image Credit: Evactron (XEI Scientific)
Image Credit: Evactron (XEI Scientific)
Image Credit: Evactron (XEI Scientific)
Use Evactron® cleaning with H2Ar or H2N for Reductive Chemistries. If alternate gases are needed to clean ruthenium-coated sapphire mirrors or any surface sensitive to oxidation, Evactron dual action turbo plasma cleaning™ removes hydrocarbon deposits without incurring sputter damage or debris. Oxygen containing gases have a significantly higher hydrocarbon removal rate but also come with some potentially unwanted side effects such as oxidation of silver and copper.
System Features
Dual-action cleaning available with plasma and UV afterglow
UHV compatibility guaranteed by Conflat 2.75 flange
RF Power of 75 W peak and provided up to 50 W continuous
Rapid cleaning—over 100 times quicker compared to early generation Evactron models
Energy-efficient radio frequency hollow cathode plasma (RFHC)
Power, recipes, number of cyclesand cleaning time are programmable
Push-button cleaning operation available
Zero sputter etch prevents damage to sensitive components
Comes with tethered touchpad command communications module
Wide range of pressure operation: ranging from 0.3 Pa/2 mTorr to 80 Pa/600 mTorr
Can be baked to 150°C
Compliant with RoHS, CE, NRTL, TUV, and SEMI
TMP-compatible, avoiding the need for advance venting
Leak tested to <10−11 mBar (1.3E−9 Pa) or 10−11 Torr
Match or gas flow adjustments are not needed for plasma ignition
Evactron U50 System Specifications
Hardware interlock is available
Evactron U50 plasma radical source
RF Power—35 to 75 W at 13.56 MHz RFHC
Desktop controller with pushbutton operation
Compliant with CE, RoHS, NRTL, TUVand SEMI
100 to 240 VAC 50/60 Hz input
Comes with tethered touchpad communication package
Chassis dimensions—W × H × D: 17.2″ × 3.5″ × 8.6″ (44 × 8.9 × 22 cm)
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