Evactron® U50: Plasma De-Contaminator for UHV Chambers

The U50 Plasma De-Contaminator from Evactron is a smalland simple plasma cleaner that features high performance for instruments and chambers designed to work at UHV conditions. The U50 provides high power cleaning to remove hydrocarbon contamination from chamber and sample surfaces.

The Evactron U50 De-Contaminator has been designed particularly for facilities that opt to make use of a wired touchpad interface to program cleaning parameters. An RS-232 cable links the touchpad (with dimensions of 134 × 112 × 69 mm) with the controller.

The streamlined PRS has a compact footprint and uses air plasma and UV afterglow to decrease hydrocarbon contamination, thus quickly providing the results.

The Evactron U50 Plasma Radical Source (PRS) has a compact design, which makes it a versatile solution for instrument chambers, sample prep chambers, or load locks. The Evactron U50 offers robust, rapidand effective cleaning throughout a comprehensive range of pressures, thereby enabling quick pumpdown time to UHV and hydrocarbon-free RGA spectra.

Image Credit: Evactron (XEI Scientific)

Image Credit: Evactron (XEI Scientific)

Image Credit: Evactron (XEI Scientific)

Use Evactron^® cleaning with H₂Ar or H₂N for Reductive Chemistries. If alternate gases are needed to clean ruthenium-coated sapphire mirrors or any surface sensitive to oxidation, Evactron dual action turbo plasma cleaning™ removes hydrocarbon deposits without incurring sputter damage or debris. Oxygen containing gases have a significantly higher hydrocarbon removal rate but also come with some potentially unwanted side effects such as oxidation of silver and copper.

System Features

Dual-action cleaning available with plasma and UV afterglow

UHV compatibility guaranteed by Conflat 2.75 flange

RF Power of 75 W peak and provided up to 50 W continuous

Rapid cleaning—over 100 times quicker compared to early generation Evactron models

Energy-efficient radio frequency hollow cathode plasma (RFHC)

Power, recipes, number of cyclesand cleaning time are programmable

Push-button cleaning operation available

Zero sputter etch prevents damage to sensitive components

Comes with tethered touchpad command communications module

Wide range of pressure operation: ranging from 0.3 Pa/2 mTorr to 80 Pa/600 mTorr

Can be baked to 150°C

Compliant with RoHS, CE, NRTL, TUV, and SEMI

TMP-compatible, avoiding the need for advance venting

Leak tested to <10⁻¹¹ mBar (1.3E⁻⁹ Pa) or 10⁻¹¹ Torr

Match or gas flow adjustments are not needed for plasma ignition

Evactron U50 System Specifications

Hardware interlock is available

Evactron U50 plasma radical source

RF Power—35 to 75 W at 13.56 MHz RFHC

Desktop controller with pushbutton operation

Compliant with CE, RoHS, NRTL, TUVand SEMI

100 to 240 VAC 50/60 Hz input

Comes with tethered touchpad communication package

Chassis dimensions—W × H × D: 17.2″ × 3.5″ × 8.6″ (44 × 8.9 × 22 cm)