EP13SPND-2 : One Component, High Strength Structural Epoxy Adhesive

Serviceable up to +500 °F, EP13SPND-2 is a one part heat curing epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature and delivers high tensile, tensile lap shear and compressive strength properties. It also offers superb dimensional stability and chemical resistance to fuels, oils, acids, bases and solvents. This dimensionally stable epoxy bonds well to many substrates including metals, glass, ceramics, composites, rubbers and most plastics. Typical cured bond line thickness is 0.002-0.008 inches. It is well suited for demanding structural bonding applications in the aerospace, specialty OEM and related industries.

Key Properties

Serviceable from -60 °F to +500 °F [-51 °C to +260 °C]

Tensile strength, 75 °F: 8,000-9,000 psi

Tensile lap shear strength, aluminum to aluminum, 75 °F: 3,000 psi

Compressive strength, 75 °F: 22,000-24,000 psi

Volume resistivity, 75 °F: >10¹⁵ ohm-cm

Dielectric constant, 75 °F, 60 Hz: 4.9