[db:国别翻译]美国S-Bond Technologies LLC

上海仪舶实验室自动化 25-08-15 16:06:31

S-Bond 产品可连接金属、陶瓷、压电陶瓷、硅及其他半导体、玻璃以及金刚石和石墨等碳材料。我们无铅、无助焊剂的活性焊料可连接各种材料,使 S-Bond 成为众多应用的理想之选。S-Bond 是一种键合技术,采用我们专利的活性焊料,该焊料含有钛和稀土元素,并与基础焊料合金相结合。凭借我们在活性焊料技术方面的专业知识,我们开发了一系列解决方案,能够以经济高效的方式组装独特的材料组合,无需电镀或使用助焊剂。

主要业务

可靠的高强度密封键合提供商

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