[db:国别翻译]美国NHanced半导体公司

NHanced Semiconductors 正在开拓先进芯片封装的未来。我们经验丰富的团队运用数十年的半导体专业知识来解决当今最紧迫的挑战。

在行业资深人士 Bob Patti 的带领下，我们正引领下一代架构的发展。我们运用 3D 堆叠、2.5D 中介层、高密度互连和芯片集等尖端工艺，提供卓越的解决方案。我们称之为 Foundry 2.0。

无论您需要中介层、2.5D 组装、TSV 插入、3D 堆叠还是混合材料集成，我们都能满足您的需求。我们的晶圆厂提供内部工艺提升、开发、原型制造以及小批量到中批量生产。

凭借 70 多种先进材料以及强大的行业合作伙伴关系，我们让芯片封装的未来成为现实。

联系我们，将您大胆的芯片愿景变为现实。

标签：NHanced

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