SB6/8e Semi-Automated Wafer Bonding System from SÜSS MicroTec AG
The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm……...
作为行业合作伙伴,标乐 (Buehler) 致力于预测不断变化的需求,开发新的设备、配件、耗材或工艺,以提高效率和成果。
标乐 (Buehler) 是材料制备、图像分析和硬度测试领域领先的科学设备、耗材和分析技术供应商,其产品广泛应用于世界各地的制造工厂、质量实验室和大学。标乐 (Buehler) 的解决方案涵盖了包括原生金属、汽车、航空航天和国防、电子、医疗、能源等众多行业,可用于分析所有类型的材料。
标乐 (Buehler) 是一家全球性公司,在 9 个国家/地区设有办事处,拥有超过 375 名员工为客户提供服务,其全球业务范围使其能够高效地设计、制造、分销和支持其产品,并努力提高客户满意度。凭借庞大的安装基础,他们继续在 ISO 9001 质量管理原则和 ISO 14001 环境管理体系下追求质量和环境承诺。
各公司使用标乐 (Buehler) 的产品和方法来改进产品中的材料、监控生产或采购的材料、进行故障分析以及开展基础材料研究。标乐 (Buehler) 的产品分为五大类:
- AbrasiMet、AbrasiMatic、IsoMet
镶嵌 - SimpliMet
研磨与抛光 - EcoMet、AutoMet、MetaServ
成像与分析 - OmniMet
硬度测试 - Wilson Hardness
The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm……...
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