Particle Characterization with a Universal Shapefinder | QICPIC
Universal shape finderQICPICoffers particle characterization ranging from below 1 µm to 34,……...
Cleaving Kit without Mat
LatticeGear provides the complete tool set for scribing and cleaving neatly, an important step in obtaining the best cross-sections–the LatticeGear Cleaving Kit-without mat. It can be used on a wide variety of substrates and wafers such as Si, GaAs, and glass.
Specifications
Diamond Scribe-pen style
Diamond Scribe-straight tip
Diamond Scribe-30° tip
Tweezers with black soft fiber fine tip (length 6 ¼”)
CleanBreak Pliers-wafer cleaving pliers
Small ruler mat-self healing, small wafer piece ruler mat
Clear plastic ruler with metric and US units
Tungsten cleaving wire
Price: US$274.60
Cleaving Kit without Mat
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