Cleaving Kit without Mat

LatticeGear provides the complete tool set for scribing and cleaving neatly, an important step in obtaining the best cross-sections–the LatticeGear Cleaving Kit-without mat. It can be used on a wide variety of substrates and wafers such as Si, GaAs, and glass.

Specifications

Diamond Scribe-pen style

Diamond Scribe-straight tip

Diamond Scribe-30° tip

Tweezers with black soft fiber fine tip (length 6 ¼”)

CleanBreak Pliers-wafer cleaving pliers

Small ruler mat-self healing, small wafer piece ruler mat

Clear plastic ruler with metric and US units

Tungsten cleaving wire

Price: US$274.60

Cleaving Kit without Mat

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