Stelter + Brinck, Ltd.
For over 40 years, Stelter & Brinck has designed and manufactured direct and indirect air hea……...
Cleaving Kit without Mat
LatticeGear provides the complete tool set for scribing and cleaving neatly, an important step in obtaining the best cross-sections–the LatticeGear Cleaving Kit-without mat. It can be used on a wide variety of substrates and wafers such as Si, GaAs, and glass.
Specifications
Diamond Scribe-pen style
Diamond Scribe-straight tip
Diamond Scribe-30° tip
Tweezers with black soft fiber fine tip (length 6 ¼”)
CleanBreak Pliers-wafer cleaving pliers
Small ruler mat-self healing, small wafer piece ruler mat
Clear plastic ruler with metric and US units
Tungsten cleaving wire
Price: US$274.60
Cleaving Kit without Mat
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