Cleaving Kit with Mat

This is the exhaustive tool kit for scribing and cleaving cleanly. This process is crucial for creating the highest quality cross-sections. This kit contains two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. It also includes a 18x12” self-healing cutting mat. This kit can be used for a large range of materials and wafers such as Si, GaAs

The standard configuration includes one each:

Diamond Scribe-Pen style

Diamond Scribe-Straight tip

Diamond Scribe-30 degree tip

Tweezers with black soft fiber fine tip (length 6 ¼”)

CleanBreak Pliers-Wafer cleaving pliers.

Large 18x12" Cutting Mat-Self healing, wafer cutting mat

Small ruler mat-Self healing, Small wafer piece ruler mat

Clear plastic ruler with metric and US units

Tungsten cleaving wire