Automated Production of Photonic Devices - AssemblyLine Systems

The AssemblyLine systems from ficonTEC are high-precision, alignmentand assembly machine solutions. They are designed for automated manufacture (align-and-attach) of photonic components. They uniquely combine fast-active alignment and flexible attachment configurations, with a proven software control interface, enclosed in an industry-standard design.

Optional modules can be added to the base configuration to provide more features, and the high-end versions provide optical test modules, wafer processing capability, and automatic tool changing.

New, advanced in-line assembly systems from ficonTEC include a redesigned platform (800, 1200, and 1600). They are provided in specific in-line configurations for insertion intocurrent production lines, and as a versatile and separate stand-alone production cell.

Additionally, they can be supplied as task-enhanced production segments that consist of different uniquely configured systems. It is feasible to visualize even complete production lines.

Software Control

ficonTEC’s Process Control Master (PCM) is a process-driven, easy-to-use application software and control interface that is provided with complete multi-machine configurations and all turnkey systems.

PCM combines a smart UI with all machine vision, high-resolution positioning, and system management procedures required for dependable and repeatable running of active/passive alignment and attachment/bonding process hardware.

It is also already totally supported for automated electro-optical test and characterization operations. It can also manage and track single lines, and even sync parallel lines remotely.

Key Features

100% automated photonic device assembly

High-accuracy AutoAlign multi-axis motion

Configurable closed-loop fast-active alignment

Epoxy dispensing, curing, and shrinkage control

Numerous chip and wafer handling options

Standard Tasks and Applications

Thermal or UV curing

Pick-and-place

Chip-to-package assembly

Active VBG spectral tuning

Fiber/FAC/SAC align-and-attach

Precision adhesive dispensing

Active mirror align-and-attach

PICs, silicon photonics

HPLD module assembly

Hybrid integrated photonics

Modular, Flexible, and (Re-)Configurable

Operate, track, and sync parallel lines remotely

FAB and HVM-ready: scalable and parallelizable

Modern feed In/Out options

Daisy-chain multiple systems for production divisions

Add and/or swap units for repurposing and reconfiguration

Single systems slot into current production lines