Automated In-Situ Nanoindentation with Hysitron PI 89 Auto SEM

上海仪舶实验室自动化 25-01-23 12:53:02

Automated In-Situ Nanoindentation with Hysitron PI 89 Auto SEM

The PI 89 Auto is an automated variant of the PI 89 system designed for high-throughput testing. It carried outthese tasks concurrently by utilizing encoded linear stages, a patented dual-configuration rotation and tilt (R/T) mechanism, and a seamless imaging/Electron Backscatter Diffraction/Energy Dispersive Spectroscopy (EBSD/EDS)interface.

PI 89 Auto Includes

Base PI 89 platform with controller

Advanced rotation and tilt (R/T) stage

TriboScan Auto software, which enables automated testing

The primary goal of PI 89 Auto is to create a relationship between the structure, processing, and qualities of different materials. This connection can help realize the relationship between material microstructure and mechanical and functional qualities.

PI 89 Auto offers a unique accomplishment in materials testing and analysis, with the potential to improve industrial processes and the performance of materials used in a variety of industries.

The SEM and EDS signals can be captured by using the tilt function of the R/T stage, and EBSD mapping can be obtained using the rotation and tilt functions.

Figure 1.The SEM and EDS signals can be captured by using the tilt function of the R/T stage, and EBSD mapping can be obtained using the rotation and tilt functions. Image Credit: Bruker Nano Surfaces and Metrology

Only PI 89 Auto Delivers

Automated nanoindentation with high throughput and minimal operator involvement

Co-localized metrology for structure-processing-property correlations supporting materials development using SEM imaging and EBSD/EDS analysis

A patented dual-configuration rotation and tilt stage that enables simple alignment with appropriate detectors

Case Study: Laser Clad Region

The laser-clad area of 410 stainless steel on a 4140 steel substrate was investigated using the PI 89 Auto. A heat-affected zone (HAZ) is produced at the base of the laser cladding region during the laser cladding process.

SEM imaging

Three unique layers were discovered: the 4140 substrate, the 4140 substrate’s HAZ, and the 410 stainless steel.

EDS elemental analysis

The 410 stainless steel area had layers high in chromium, and the 4140 substrate and HAZ both had phases rich in iron.

Nanoindentation for mechanical properties

Using the TriboScan Auto software, seven positions were chosen on the live SEM image across the layers. Partial unloading indentations were made at these points, and hardness and modulus profiles were created.

Correlated results and analysis

The heat-affected zone, according to the results, had a greater hardness than the 4140 substrate and 410 stainless steel. The high heat changes the microstructure of 4140 steel, increasing its hardness to a thin layer with tiny grains and martensite at the grain boundaries.

The SEM and EDS signals can be captured by using the tilt function of the R/T stage, and EBSD mapping can be obtained using the rotation and tilt functions.

The SEM and EDS signals can be captured by using the tilt function of the R/T stage, and EBSD mapping can be obtained using the rotation and tilt functions.

Figure 2.Co-localized SEM imaging (top), EDS analysis (middle), and hardness profiling (bottom) of a laser clad region of 410 stainless steel onto a 4140 steel substrate. Image Credit: Bruker Nano Surfaces and Metrology

PI 89 Auto Specifications. Source: Bruker Nano Surfaces and Metrology

. .
Load with base PI 89 Auto 10 mN
Load noise floor <400 nN
Maximum displacement with base PI 89 Auto 5 μm
Displacement noise floor <1 nm
Option – Maximum load 300 mN
Load noise floor <5 μm
Option – Maximum displacement 150 μm
Displacement noise floor <1 nm
Stage travel (x, y, z), where y is the indentation axis 26 mm, 29 mm, and 12 mm
Linear stage resolution 1 nm
R/T stage travel 180° and 90°
R/T stage resolution 0.33° rotation stage, 0.18° tilt stage
Overall positioning accuracy from imaging and EBSD position Typically 5 μm*

*The accuracy specification may change depending upon the SEM environment, SEM stage encoder, stage heating, and drift. Guaranteed accuracy <30 μm.

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