Automated FIB Serial Sectioning With Enhanced 3D EDS and EBSD Features

The Thermo Scientific Auto Slice andView 5 (AS&V5) Software facilitates the automated collection of high-resolution 3D images and analytical mappings, including EBSD (electron backscatter diffraction) and EDS (energy-dispersive X-Ray spectroscopy).

AS&V5 Software acquires data by milling serial sections (slices) of a sample with a focused ion beam (FIB) and then imaging and/or mapping each slice. Due to the high value and unique nature of many samples, it is important to collect as much information as possible from each section.

With the help of AS&V5 Software, users can obtain data from various imaging and analysis modalities for each slice, including material and channeling contrast produced by several FIB and SEM detectors. Moreover, EBSD mapping can be used to provide grain orientation/strain-texture analysis, and EDS can be used to gather elemental information.

Spin Mill Functionality

Spin Mill Science, an enhancement for the Auto Slice & View 5 Software, facilitates targeted large-area polishing and 3D characterization. Compatible with PFIBs and Hydra DualBeams, this software automates the process of sequential milling and imaging for areas as large as 1 mm.

3D reconstruction of the thermal barrier coating on a ramjet aero engine afterburner nozzle showing the microstructure state at the end of the exhaust system’s life. The overlaid EDS map shows elemental distribution on the top coat and bond coat interface: blue is aluminum, yellow is magnesium, and turquoise is yttria. Data produced using a Thermo Scientific Helios 5 PFIB, Auto Slice & View 5 Software, and Avizo Software for materials science. Scale bar is 150 microns. Image Credit: Thermo Fisher Scientific – Electron Microscopy Solutions

Auto Slice and View Software Features

Intuitive, Easy-to-use UI

Streamlined workflows, milling recipes, and integrated auto functions.

Integrated Imaging

Integrates SEM and FIB imaging, EBSD and EDS mapping into one package.

High Speed and Throughput

High throughput and speed with multi-site support.

Digital Tilt-Shift Compensation

Improve collection efficiency and accuracy.

Information on Every Slice

Acquire all the information on every slice (imaging, analytics, current, voltage, tilt, etc.).

On-the-Fly Editing Capabilities

If experiencing a phase or microstructural change, adjust the parameters as necessary.

Highly Flexible and Reliable Acquisition

Highly flexible and reliable acquisition with precise and repeatable cut placement.