The UltraMap 200-BP Automated Wafer Thickness and Flatness Metrology System from MicroSense
The UltraMap 200-BP is a flexible wafer measurement system that is capable of measuring wafer thi……...
Aurea Imaging Ltd.
Aurea Imaging computes spectral analysis from hyperspectral cubes acquired from remote sensors. Aurea Imaging use InSAR technology to determine surface deformations induced by open pit and underground mining operations (hard rock operations), and to monitor changes in pit depths, heights of stock- piles and waste dumps, and levels of tailing dumps to provide important production data.
Primary Activity
Service Provider / ConsultantSubsidence, Exploration, Monitoring, Topography
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