ASD Leaf Clip
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American Precision Dicing Inc.
American Precision Dicing began offering its services in 1992, in response to an unmet need for quick turn custom dicing of silicon wafers for the semiconductor industry.
Since then APD's processes have evolved to become industry acclaimed solutions for a much broader range of hard brittle metals.
APD's principals have extensive backgrounds in Silicon Valley's high tech world. Together, they have 16 years of dicing experience and over 50 years of electronics industry experience.
Primary Activity
Material Manufacturer
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