AI Technology, Inc.

Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced material and adhesive solution for electronic interconnection and packaging. The company has a ISO9001:2000 certified manufacturing and R&D facility in the U.S. and a Far East Service Center in Hong Kong. The headquarters has more than 50,000 square feet of manufacturing facilities for its die and substrate attached adhesive films and pastes: thermal interface materials (TIM) including insulated metal substrates, gap-filling compressible phase-change pad, thermal gel, thermal grease and adhesive films and pastes; electromagnetic and radio frequency interference (EMI/RFI) mitigation material solutions including conductive gaskets, form-in-place (FIP) conductive gaskets, self-attached shielding covers/cans/lids, conductive caulks and adhesives; and advanced organic copper-clad laminates from 1/4 oz to 1 oz copper within a 16-acre campus in Princeton Junction, NJ.